category: Top Stories

category: Auto, Security & Edge AI

Next Challenge: Contact Resistance
By Mark LaPedus - 23 Jun, 2016 - Comments: 0

In chip scaling, there is no shortage of challenges. Scaling the finFET transistor and the interconnects are the biggest challenges for current and future devices. But now, there is another part of the device that’s becoming an issue—the contact. Typically, the contact doesn’t get that much attention, but the industry is beginning to worry about the resistance in the contacts, or conta... » read more

Waiting For 5G Technology
By Mark LaPedus - 23 Jun, 2016 - Comments: 1

For some time, carriers, equipment OEMs and chipmakers have been gearing up for the next-generation wireless standard called 5th generation mobile networks, or 5G. 5G is the follow-on to the current wireless standard known as 4G, or long-term evolution (LTE). It will enable data transmission rates of more than 10Gbps, or 100 times the throughput of LTE. But the big question is whether 5G wil... » read more

Executive Insight: Aki Fujimura
By Mark LaPedus - 23 Jun, 2016 - Comments: 1

Aki Fujimura, chief executive of D2S, sat down with Semiconductor Engineering to look at the key issues in lithography and photomasks, as well as the changes taking place in the IC industry. What follows are excerpts of that conversation. SE: The semiconductor market is changing on several fronts. On one front, there is a wave of consolidation in the industry. And then there is a slowdown in... » read more

Decoding The Brain
By Brian Bailey - 22 Jun, 2016 - Comments: 1

At the Design Automation Conference this year, Lou Scheffer, principal scientist for the Howard Hughes Medical Institute, gave a visionary talk entitled Learning from Life: Biologically Inspired Electronic Design. Scheffer is an IC design guy who came through Stanford and Caltech and worked for HP and [getentity id="22032" e_name="Cadence"] before switching to the medical field eight years a... » read more

Photonics Moves Closer To Chip
By Ed Sperling - 20 Jun, 2016 - Comments: 0

Silicon photonics is resurfacing after more than a decade in the shadows, driven by demands to move larger quantities of data faster, using extremely low power and with minimal heat. Until recently, much of the attention in photonics focused on moving data between servers and storage. Now there is growing interest at the PCB level and in heterogeneous multi-chip packages. Government, academi... » read more

CPU, GPU, or FPGA?
By Jeff Dorsch - 16 Jun, 2016 - Comments: 0

Nvidia’s new GeForce GTX 1080 gaming graphics card is a piece of work. Employing the company’s Pascal architecture and featuring chips made with a 16nm [getkc id="185" kc_name="finFET"] process, the GTX 1080’s GP104 graphics processing units boast 7.2 billion transistors, running at 1.6 GHz, and it can be overclocked to 1.733 GHz. The die size is 314 mm², 21% smaller than its GeForce ... » read more

Near-Threshold Computing
By Brian Bailey - 16 Jun, 2016 - Comments: 2

The emergence of the Internet of Things (IoT) has brought a lot of attention to the need for extremely low-power design, and this in turn has increased the pressure for voltage reduction. In the past, each new process node shrunk the feature size and lowered the nominal operating voltage. This resulted in a drop in power consumption. However, the situation changed at about 90nm in two ways. ... » read more

Big Data Meets Chip Design
By Ann Mutschler - 16 Jun, 2016 - Comments: 0

The amount of data being handled in chip design is growing significantly at each new node, prompting chipmakers to begin using some of the same concepts, technologies and algorithms used in data centers at companies such as Google, Facebook and GE. While the total data sizes in chip design are still relatively small compared with cloud operations—terabytes per year versus petabytes and exa... » read more

The Future Of Memory
By Ed Sperling - 16 Jun, 2016 - Comments: 2

Semiconductor Engineering sat down to discuss future memory with Frank Ferro, senior director of product management for memory and interface IP at [getentity id="22671" e_name="Rambus"]; Marc Greenberg, director of product marketing at [getentity id="22035" e_name="Synopsys"]; and Lisa Minwell, [getentity id="22242" e_name="eSilicon"]'s senior director of [getkc id="43" kc_name="IP"] marketing.... » read more

How To Build Systems In Package
By Ed Sperling - 15 Jun, 2016 - Comments: 0

The semiconductor industry is racing to define a series of road maps for semiconductors to succeed the one created by the ITRS, which will no longer be updated, including a brand new one focused on heterogeneous integration. The latest entry will establish technology targets for integration of heterogeneous multi-die devices and systems. It has the support of IEEE's Components, Packaging and... » read more

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