category: Top Stories

category: IoT, Security & Automotive

Automation And AI Improve Failure Analysis
By Laura Peters - 11 Mar, 2025 - Comments: 0

When a chip malfunctions it’s the job of the failure analysis engineer to determine how it failed or significantly deviated from its key performance metrics. The cost of failure in the field can be huge in terms of downtime, recalls, damage to a company’s reputation, and more. For these reasons, chipmakers take customer returns very seriously, focusing resources to quickly get to the bot... » read more

Cutting IC Manufacturing Costs By Combining Data
By Anne Meixner - 11 Mar, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the benefits of incorporating financial data into fab floor decision-making, including what kind of cost data is most useful, with Dieter Rathei, CEO of DR Yield; Jon Holt, senior director of product management at PDF Solutions, Alex Burlak, vice president of advanced analytics and test at proteanTecs; and Dirk de Vries, techni... » read more

Failure To Launch
By Gregory Haley - 11 Mar, 2025 - Comments: 1

Failure analysis (FA) is an essential step for achieving sufficient yield in semiconductor manufacturing, but it’s struggling to keep pace with smaller dimensions, advanced packaging, and new power delivery architectures. All of these developments make defects harder to find and more expensive to fix, which impacts the reliability of chips and systems. Traditional failure analysis techniqu... » read more

Software-Defined Radar Is First Leap On SDV Path
By Junko Yoshida - 06 Mar, 2025 - Comments: 0

Software-defined vehicles (SDVs) have had car company marketers in a veritable tizzy for several years, and while they generally agree on the direction, they differ on the speed and route to adoption. For most OEMs, a wholesale change in vehicle architecture, from hood ornament to trunk-latch, is easier said than done. Legacy systems, both hardware and software, are the millstone around OEMs... » read more

Wearable Connectivity, AI Enable New Use Cases
By Liz Allan - 06 Mar, 2025 - Comments: 0

The sensing and processing technology used in smart phones, watches, and rings is starting to be being deployed in a wide variety of wearable devices, ranging from those that fill the gap between sports and med tech, to haptic devices to assist the visually impaired and AR/VR glasses. Emerging applications include payment, building, and factory wearables. Most of these devices process signal... » read more

Verification Experts Vs. Generalists
By Ann Mutschler - 05 Mar, 2025 - Comments: 0

Experts At The Table: As chips and systems become more complicated, more verification tasks get abstracted. So do we need more specialists who are experts in specific tasks, or do we need more generalists who know how to use the tools but don't necessarily have the depth of understanding? Or do we need some way to balance both? Semiconductor Engineering sat down with a panel of experts, includi... » read more

Challenges Grow For Medical ICs
By Gregory Haley - 03 Mar, 2025 - Comments: 0

Demand for medical ICs used inside and outside the body is growing rapidly, but unique manufacturing and functional requirements coupled with low volumes have turned this into a complex and extremely challenging market. Few semiconductor applications demand this level of precision, reliability, and long-term stability. Unlike consumer electronics, where failure might mean a reboot or chip re... » read more

Improving Verification Methodologies
By Brian Bailey - 27 Feb, 2025 - Comments: 0

Methodology improvements and automation are becoming pivotal for keeping pace with the growing complexity and breadth of the tasks assigned to verification teams, helping to compensate for lagging speed improvements in the tools. The problem with the tools is that many of them still run on single processor cores. Functional simulation, for example, cannot make use of an unlimited number of c... » read more

Lines Blurring Between Supercomputing And HPC
By Ann Mutschler - 27 Feb, 2025 - Comments: 1

Supercomputers and high-performance computers are becoming increasingly difficult to differentiate due to the proliferation of AI, which is driving huge performance increases in commercial and scientific applications and raising similar challenges for both. While the goals of supercomputing and high-performance computing (HPC) have always been similar — blazing fast processing — the mark... » read more

Multi-Die Design Complicates Data Management
By Adam Kovac - 27 Feb, 2025 - Comments: 0

The continued unbundling of SoCs into multi-die packages is increasing the complexity of those designs and the amount of design data that needs to be managed, stored, sorted, and analyzed. Simulations and test runs are generating increasing amounts of information. That raises questions about which data needs to be saved and for how long. During the design process, engineers now must wrestle ... » read more

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