category: Top Stories

category: IoT, Security & Automotive

Battling Over Shrinking Physical Margin In Chips
By Ed Sperling - 31 Jul, 2023 - Comments: 0

Smaller process nodes, coupled with a continual quest to add more features into designs, are forcing chipmakers and systems companies to choose which design and manufacturing groups have access to a shrinking pool of technology margin. In the past margin largely was split between the foundries, which imposed highly restrictive design rules (RDRs) to compensate for uncertainties in new proces... » read more

Shift Left, Extend Right, Stretch Sideways
By Brian Bailey - 27 Jul, 2023 - Comments: 0

The EDA industry has been talking about shift left for a few years, but development flows are now being stretched in two additional ways, extending right to include silicon lifecycle management, and sideways to include safety and security. In addition, safety and security join verification and power as being vertical concerns, and we are increasingly seeing interlinking within those concerns. ... » read more

The Good And Bad Of Chip Design On Cloud
By Ann Mutschler - 27 Jul, 2023 - Comments: 0

Semiconductor Engineering sat down to talk about how the shift toward chip design on cloud has sped up, whether the benefits of cloud are realized in chip design, and some of the most pressing challenges to chip design on cloud today, with Philip Steinke, fellow, CAD infrastructure and physical design at AMD; Mahesh Turaga, vice president of business development for cloud at Cadence Design Syst... » read more

Large-Scale Integration’s Future Depends On Modeling
By Karen Heyman - 27 Jul, 2023 - Comments: 0

VLSI is a term that conjures up images of a college textbook, but some of the concepts included in very large-scale integration remain relevant and continue to evolve, while others have fallen by the wayside. The portion of VLSI that remains most relevant for semiconductor industry is "integration," which is pushing well beyond the edges of a monolithic planar chip. But that expansion also i... » read more

High-NA Lithography Starting To Take Shape
By Gregory Haley - 25 Jul, 2023 - Comments: 3

The future of semiconductor technology is often viewed through the lenses of photolithography equipment, which continues to offer better resolution for future process nodes despite an almost perpetual barrage of highly challenging technological issues. For years, lithography was viewed as the primary manufacturing-related gating factor to continued device scaling, beset by multiple delays th... » read more

Using ML For Improved Fab Scheduling
By Katherine Derbyshire - 25 Jul, 2023 - Comments: 0

Expanding fab capacity is slow and expensive even under ideal circumstances. It has been still more difficult in recent years, as pandemic-related shortages have strained equipment supply chains. When integrated circuit demand rises faster than expansions can fill the gap, fabs try to find “hidden” capacity through improved operations. They hope that more efficient workflows will allow e... » read more

Goals of Going Green
By Anne Meixner - 25 Jul, 2023 - Comments: 0

The chip industry is stepping up efforts to be seen as environmentally friendly, driven by growing pressure from customers and government regulations. Some manufacturers have been addressing sustainability challenges for more than a decade, but they are becoming more aggressive in their efforts, while others are joining them. A review of sustainability reports across the semiconductor indust... » read more

Improving Performance And Lowering Power In Automotive
By Ann Mutschler - 20 Jul, 2023 - Comments: 0

Automotive OEMs are boosting their investments across the semiconductor ecosystem as stepping stones toward electrification and autonomy, and they are starting to encounter some of the same issues chipmakers have been wrestling with at advanced nodes — massive compute performance, thermal and power issues, reliability over extended lifetimes, and a highly diverse and geographically distribute... » read more

Getting Rid Of Heat In Chips
By Brian Bailey - 20 Jul, 2023 - Comments: 1

Power consumed by semiconductors creates heat, which must be removed from the device, but how to do this efficiently is a growing challenge. Heat is the waste product of semiconductors. It is produced when power is dissipated in devices and along wires. Power is consumed when devices switch, meaning that it is dependent upon activity, and that power is constantly being wasted by imperfect de... » read more

HBM’s Future: Necessary But Expensive
By Karen Heyman - 20 Jul, 2023 - Comments: 0

High-bandwidth memory (HBM) is becoming the memory of choice for hyperscalers, but there are still questions about its ultimate fate in the mainstream marketplace. While it’s well-established in data centers, with usage growing due to the demands of AI/ML, wider adoption is inhibited by drawbacks inherent in its basic design. On the one hand, HBM offers a compact 2.5D form factor that enables... » read more

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