Making Connections


By Ed Sperling The world is still full of engineers who can build fast interconnects to things like PCI Express or USB 2.0 who can create complex schematics for determining the connections between a processor core, memory, logic and various IP blocks on a piece of silicon. But over the next several years, many of those engineers will have to figure out new ways to make a living. The numbe... » read more

We Changed Our Name


Low-Power Design today changes its name to Low-Power Engineering reflecting a broader context for low-power issues that extend well beyond the confines of just design. We discovered the need for this change several months ago—and many stories after launching Low-Power Design. Polls of our readers and our sponsors, which we conduct on a regular basis, showed our name was too narrow for the ... » read more

Considerations For Choosing The Right Low-Power Tools


By Cheryl Ajluni Regardless of what you are designing these days, one fact holds true: Your design is only as good as the design tools you use. Gone are the days when a design could be done on the back of napkin. Today, engineers require a complex ecosystem of interworking tools to guide them through the complex design flow. This is especially true when it comes to low-power design, as i... » read more

End User Report: Reliability


John Kern, vice president of product operations inside Cisco Systems’ customer value chain management group, sat down with Low-Power Engineering to talk about the company’s internal focus on reliability and what factors are causing the most concern. What follows are excerpts of that conversation. By Ed Sperling LPE: How does Cisco gauge reliability? John Kern: The bulk of our re... » read more

Battery Progress Inches Forward


By Ed Sperling Chip companies that have been betting the future on better battery technology and holding off on the often painful process of reducing voltage should probably start rethinking their plans. Battery technology is not expected to improve by more than 3% per year, and even that may slow. Compared with the chip side, there are no breakthrough materials such as halfnium or techno... » read more

Defining Reliability In Low-Power Designs


By Ann Steffora Mutschler Having a clear understanding of what reliability means for a particular low-power application can make a significant difference when it comes to communicating with engineering team members and customers. Is reliability simply a question of how long a device can run without errors? And what happens to reliability when power modeling, verification and other design tec... » read more

Multicore Meets Multichannel Memory


Rambus Fellow Craig Hampel talks with System-Level Design about the next bottlenecks in high-performance computing and how to solve them. [youtube vid=jbNg1xdZUoU] » read more

Designing Systems For Power And Throughput


  By Ed Sperling The most energy being consumed inside of processors is no longer for computation. It’s stuff that’s most chip designers think about after the design is completed, such as communication inside and outside the chip, managing those communications and the power levels across the chip. Research from Intel Labs, unveiled at the Intel Developer Forum this week, show that... » read more

Verification As A Deterrent?


By Ed Sperling Verification is becoming more than a bottleneck in semiconductor design. It’s actually deterring companies from adopting the latest techniques for saving power or building certain features into chips. The problem is one of complexity, and it’s getting worse at every node. While the tools exist to do complex designs, there are the classic tradeoffs of area, power and per... » read more

Get Ready For 3D


By Pallab Chatterjee The advent of digital imaging in the production, broadcast and projection of films will drive the current 3D craze into a sustainable long-term trend. The digital medium allows for “headache-free” viewing and is expected to produce about $1 billion in revenue this year in North America. What’s changed this time is 3D formats will not be limited to feature films in t... » read more

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