category: Top Stories

category: Auto, Security & Edge AI

What Happens When The Plug Is Pulled
By Ed Sperling - 12 Jan, 2012 - Comments: 0

By Pallab Chatterjee The Consumer Electronics Show featured a large variety of new devices and peripherals for the mobile and portable space. In addition to the tablet, which is the fastest growing data-consumption platform, and the laptop, which is the fastest-growing data creation and modification platform, there are a large number of peripheral devices that are being released. These devi... » read more

The Next Big Challenge
By Ed Sperling - 12 Jan, 2012 - Comments: 0

By Ed Sperling Software is the next big target in the quest to make electronics more energy efficient, but it’s proving a far bigger challenge than most systems architects originally believed it would be. There are several very large big problems to deal with in software. Writing efficient code for small processors isn’t one of them. In fact, the proliferation of small processors across... » read more

Status Report: Power-Aware Design Flow
By Ed Sperling - 12 Jan, 2012 - Comments: 0

By Ann Steffora Mutschler While the term “design flow” can be a moving target, there are some specific requirements for a low-power/power-aware tool flow. Looking at this from a high level, where is the industry today, and where is it headed? There are really two sides to power, which are almost like two sides of the same coin: power consumption and power integrity. And both of those ar... » read more

Rethinking Good Enough
By Ed Sperling - 12 Jan, 2012 - Comments: 0

By Ed Sperling Power has been elevated from an afterthought to one of the top considerations and tradeoffs in SoC design, edging out performance and area in many cases and in some cases even cost and features. Tradeoffs in design always change, depending upon what the most pressing concern is among consumers at any time. For decades, performance was always the top of anyone’s list, follow... » read more

How Long Will 28nm Last?
By Ed Sperling - 12 Jan, 2012 - Comments: 0

By Ann Steffora Mutschler As soon as a next generation semiconductor manufacturing process node is out, bets are taken on just how long the current advanced process node will last. The 28/20nm transition is no exception. There is certainly a benefit to moving from 40nm to 28nm. The  availability of high-k/metal gate technology offers quite a few advantages in terms of power reduction... » read more

Thinking Differently About Power
By Ed Sperling - 12 Jan, 2012 - Comments: 0

By Ed Sperling Battery life and lower electricity bills are now marketing tools for makers of SoCs, the mobile devices they go into, and servers that power data centers. A smart phone battery that lasts through the day without a charge, even when the user is playing high-action games, is a lot more attractive than one lasting only a few hours. And a data center electricity bill that shows a sh... » read more

Rebalancing Power, Performance And Area
By Ed Sperling - 15 Dec, 2011 - Comments: 0

By Ed Sperling The tradeoffs between performance, power and area are being fine-tuned to a degree never seen before in the IC business, driven partly by complexity, partly by better tools, and partly by the need to gain a competitive edge in specific applications. Just being able to make these kinds of tradeoffs is a technological feat that marries everything from high-level modeling and sy... » read more

Too Many Standards, But Still Not Enough
By Ed Sperling - 15 Dec, 2011 - Comments: 0

By Ed Sperling The semiconductor industry has been one of the most prolific sectors in history when it comes to generating standards. Talk to any design engineer facing time-to-market pressures, new packaging approaches, and a mindboggling number of merchant IP, subsystems and interface requirements, and you’ll hear a compelling pitch for new standards. Talk to his or her boss and you’ll p... » read more

Off The Planar
By Ed Sperling - 15 Dec, 2011 - Comments: 0

By Pallab Chatterjee 3D devices, FinFETs and new memory technologies are not just a future direction anymore. They’re real. That became evident at this year’s IEDM conference, where the focus of a number of sessions was on modeling, failure and reliability models, as well as lower power supply operations for these devices. Because FinFETs are not standard 2D MOS devices, their use i... » read more

Model-Driven Design: Making Progress
By Ed Sperling - 15 Dec, 2011 - Comments: 0

By Ann Steffora Mutschler Model-driven design is coming into its own, in part because the old way of using models at advanced nodes doesn’t always produce usable chips and in part because of the need for making tradeoffs at the earliest stages of the design process. The concept of developing models for IC design is hardly a new one, and it is being done today on a number of levels rangin... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy