category: Top Stories

category: IoT, Security & Automotive

Why Silent Data Errors Are So Hard To Find
By Anne Meixner - 11 Oct, 2022 - Comments: 1

Cloud service providers have traced the source of silent data errors to defects in CPUs — as many as 1,000 parts per million — which produce faulty results only occasionally and under certain micro-architectural conditions. That makes them extremely hard to find. Silent data errors (SDEs) are random defects produced in manufacturing, not a design bug or software error. Those defects gene... » read more

Yield Is Top Issue For MicroLEDs
By Laura Peters - 11 Oct, 2022 - Comments: 0

MicroLED display makers are marching toward commercialization, with products such as Samsung’s The Wall TV and Apple’s smart watch expected to be in volume production next year or in 2024. These tiny illuminators are the hot new technology in the display world, enabling higher pixel density, better contrast, lower power consumption, and higher luminance in direct sunlight — while consu... » read more

Bump Co-Planarity And Inconsistencies Cause Yield, Reliability Issues
By Karen Heyman - 11 Oct, 2022 - Comments: 0

Bumps are a key component in many advanced packages, but at nanoscale levels making sure all those bumps have a consistent height is an increasing challenge. Without co-planarity, surfaces may not properly adhere. That can reduce yield if the problem is not identified in packaging, or it can cause reliability problems in the field. Identifying those issues requires a variety of process steps... » read more

EVs Raise Energy, Power, And Thermal IC Design Challenges
By Ann Mutschler - 06 Oct, 2022 - Comments: 0

The transition to electric vehicles is putting pressure on power grids to produce more energy and on vehicles to use that energy much more efficiently, creating a gargantuan set of challenges that will affect every segment of the automotive world, the infrastructure that supports it, and the chips that are required to make all of this work. From a semiconductor standpoint, improvements in th... » read more

Testing Chips For Security
By Jeff Goldman - 06 Oct, 2022 - Comments: 0

Supply chains and manufacturing processes are becoming increasingly diverse, making it much harder to validate the security in complex chips. To make matters worse, it can be challenging to justify the time and expense to do so, and there’s little agreement on the ideal metrics and processes involved. Still, this is particularly important as chip architectures evolve from a single chip dev... » read more

Auto Safety Tech Adds New IC Design Challenges
By John Koon - 06 Oct, 2022 - Comments: 1

The role of AI/ML in automobiles is widening as chipmakers incorporate more intelligence into chips used in vehicles, setting the stage for much safer vehicles, fewer accidents, but much more complex electronic systems. While full autonomy is still on the distant horizon, the short-term focus involves making sure drivers are aware of what's going on around them — pedestrians, objects, or o... » read more

Startup Funding: September 2022
By Jesse Allen - 05 Oct, 2022 - Comments: 0

The onshoring and buildout of dozens of fabs, many costing tens of billions of dollars, is beginning to spill over into other areas that are critical for chip manufacturing. Materials, in particular, which often gets little attention outside of chip manufacturing, witnessed a big spike in September 2022. In fact, seven materials companies covered in this report made up more than a third of the ... » read more

IC Architectures Shift As OEMs Narrow Their Focus
By Ed Sperling - 03 Oct, 2022 - Comments: 0

Diminishing returns from process scaling, coupled with pervasive connectedness and an exponential increase in data, are driving broad changes in how chips are designed, what they're expected to do, and how quickly they're supposed to do it. In the past, tradeoffs between performance, power, and cost were defined mostly by large OEMs within the confines of an industry-wide scaling roadmap. Ch... » read more

Verification Methodologies Evolve, But Slowly
By Brian Bailey - 29 Sep, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss digital twins and what is required to develop and verify new chips across a variety of industries, such as automotive and aerospace, with Larry Lapides, vice president of sales for Imperas Software; Mike Thompson, director of engineering for the verification task group at OpenHW; Paul Graykowski, technical marketing manager for Arteris IP; Shantanu ... » read more

DNA Edges Forward As Data Storage Option
By Bernadette Tansey - 28 Sep, 2022 - Comments: 0

At technology conferences back in 2015, scientist David Markowitz raised the idea that DNA could be adapted as a data storage material. The audience response wasn’t all he had hoped for. “They would laugh me off the podium,” Markowitz recalls, but without rancor. Facing skepticism comes with his job at IARPA, the research arm of the U.S. intelligence community. The agency anticipates f... » read more

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