category: Top Stories

category: IoT, Security & Automotive

Telecare Challenges: Secure, Reliable, Lower Power
By John Koon - 20 Jul, 2022 - Comments: 0

The adoption of telecare using a variety of connected digital devices is opening the door to much more rapid response to medical emergencies, as well as more consistent monitoring, but it also is adding new challenges involving connectivity, security, and power consumption. Telecare has been on the horizon for the better part of two decades, but it really began ramping with improvements in s... » read more

Heterogenous Integration Creating New IP Opportunities
By Brian Bailey - 19 Jul, 2022 - Comments: 0

The design IP market has long been known for constant change and evolution, but the industry trend toward heterogenous integration and chiplets is creating some new challenges and opportunities. Companies wanting to stake out a claim in this area have to be nimble, because there will be many potential standards introduced, and they are likely to change quickly as the industry explores what is r... » read more

Using AI To Speed Up Edge Computing
By John Koon - 19 Jul, 2022 - Comments: 0

AI is being designed into a growing number of chips and systems at the edge, where it is being used to speed up the processing of massive amounts of data, and to reduce power by partitioning and prioritization. That, in turn, allows systems to act upon that data more rapidly. Processing data at the edge rather than in the cloud provides a number of well-documented benefits. Because the physi... » read more

Data Management Evolves
By Ann Mutschler - 19 Jul, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss data management challenges with Jerome Toublanc, business development executive at Ansys; Kam Kittrell, vice president of product management in the Digital & Signoff Group at Cadence; Simon Rance, vice president of marketing at Cliosoft; Rob Conant, vice president of software and ecosystem at Infineon Technologies; and Michael Munsey, senior dir... » read more

Customization, Heterogenous Integration, And Brute Force Verification
By Ed Sperling - 14 Jul, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss why new approaches are required for heterogeneous designs, with Bari Biswas, senior vice president for the Silicon Realization Group at Synopsys; John Lee, general manager and vice president of the Ansys Semiconductor business unit; Michael Jackson, corporate vice president for R&D at Cadence; Prashant Varshney, head of product for Microsoft Azu... » read more

What Future Processors Will Look Like
By Ed Sperling - 13 Jul, 2022 - Comments: 0

Mark Papermaster, CTO at AMD, sat down with Semiconductor Engineering to talk about architectural changes that are required as the benefits of scaling decrease, including chiplets, new standards for heterogeneous integration, and different types of memory. What follows are excerpts of that conversation. SE: What does a processor look like in five years? Is it a bunch of chips in a package? I... » read more

Improving Yield With Machine Learning
By Laura Peters - 12 Jul, 2022 - Comments: 0

Machine learning is becoming increasingly valuable in semiconductor manufacturing, where it is being used to improve yield and throughput. This is especially important in process control, where data sets are noisy. Neural networks can identify patterns that exceed human capability, or perform classification faster. Consequently, they are being deployed across a variety of manufacturing proce... » read more

Finding Frameworks For End-To-End Analytics
By Anne Meixner - 12 Jul, 2022 - Comments: 0

End-to-end analytics can improve yield and ROI on tool purchases, but reaping those benefits will require common data formats, die traceability, an appropriate level of data granularity — and a determination of who owns what data. New standards, guidelines, and consortium efforts are being developed to remove these barriers to data sharing for analytics purposes. But the amount of work req... » read more

E-beam’s Role Grows For Detecting IC Defects
By Karen Heyman - 12 Jul, 2022 - Comments: 1

The perpetual march toward smaller features, coupled with growing demand for better reliability over longer chip lifetimes, has elevated inspection from a relatively obscure but necessary technology into one of the most critical tools in fab and packaging houses. For years, inspection had been framed as a battle between e-beam and optical microscopy. Increasingly, though, other types of insp... » read more

Security Risks Widen With Commercial Chiplets
By Ed Sperling - 07 Jul, 2022 - Comments: 0

The commercialization of chiplets is expected to increase the number and breadth of attack surfaces in electronic systems, making it harder to keep track of all the hardened IP jammed into a package and to verify its authenticity and robustness against hackers. Until now this has been largely a non-issue, because the only companies using chiplets today — AMD, Intel, and Marvell — interna... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy