category: Top Stories

category: IoT, Security & Automotive

Repositioning For A Changing IC Market
By Ed Sperling - 26 May, 2022 - Comments: 0

Sailesh Chittipeddi, executive vice president at Renesas, sat down with Semiconductor Engineering to talk about how changes in end markets are shifting demand for technology. What follows are excerpts of that conversation. SE: Renesas has acquired a number of companies over the past several years. What's the goal? Chittipeddi: The goal very simply is to create an industry leading solutio... » read more

Embedded Software: Sometimes Easier, Often More Complex
By Ann Mutschler - 25 May, 2022 - Comments: 0

Embedded software, once a challenge to write, update, and optimize, is following the route of other types of software. It is abstracted, simpler to use, and much faster to write. But in some cases, it's also much harder to get right. From a conceptual level, the general definition of embedded software has not changed much. It's still low-level drivers and RTOSes that run close to the hardwar... » read more

Standardizing Chiplet Interconnects
By John Koon - 23 May, 2022 - Comments: 0

The chip industry is making progress on standardizing the infrastructure for chiplets, setting the stage for faster and more predictable integration of different functions and features from different vendors. The ability to choose from a menu of small, highly specialized chips, and to mix and match them for specific applications and use cases, has been on the horizon for more than a decade. ... » read more

Wafer Shortage Improvement In Sight For 300mm, But Not 200mm
By Adele Hars - 19 May, 2022 - Comments: 2

The supply chain for bare wafers is off-kilter. Demand is appreciably higher than the wafer suppliers can keep up with, creating shortages that could last for years. For 300mm starting wafers, the top five big players — SEH and Sumco of Japan, Siltronic of Germany, GlobalWafers of Taiwan, and SK Siltron of Korea — finally took action over the last year, spending billions on new wafer fac... » read more

Shortages Spark Novel Component Lifecycle Solutions
By Laura Peters - 19 May, 2022 - Comments: 0

The semiconductor industry’s supply chain problems are prompting some innovative solutions and workarounds, and while they don't solve all problems, they are improving efficiency and extending equipment lifetimes. The shortages, which affect everything from the chips used in automotive, IoT, and consumer ICs to the equipment used to manufacture and test them — span global supply lines. T... » read more

Driving Toward More Rugged, Less Expensive SiC
By Katherine Derbyshire - 19 May, 2022 - Comments: 0

Silicon carbide is gaining traction in the power semiconductor market, particularly in electrified vehicles, but it's still too expensive for many applications. The reasons are well understood, but until recently SiC was largely a niche technology that didn't warrant the investment. Now, as demand grows for chips that can work in high-voltage applications, SiC is getting a much closer look. ... » read more

Bridging IC Design, Manufacturing, And In-Field Reliability
By Ed Sperling - 18 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about silicon lifecycle management and how that can potentially glue together design, manufacturing, and devices in the field, with Prashant Goteti, principal engineer at Intel; Rob Aitken, R&D fellow at Arm; Zoe Conroy, principal hardware engineer at Cisco; Subhasish Mitra, professor of electrical engineering and computer sci... » read more

New End Markets, More Demand For Complex Chips
By Ed Sperling - 16 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss economic conditions and how that affects chip design with Anirudh Devgan, president and CEO of Cadence; Joseph Sawicki, executive vice president of Siemens EDA; Niels Faché, vice president and general manager at Keysight; Simon Segars, advisor at Arm; and Aki Fujimura, chairman and CEO of D2S. This discussion was held in front... » read more

DRAM Choices Becoming Central Design Considerations
By Ann Mutschler - 12 May, 2022 - Comments: 0

Chipmakers are paying much closer attention to various DRAM options as they grapple with what goes on-chip or into a package, elevating attached memory to a critical design element that can affect system performance, power, and cost. These are increasingly important issues to sort through with a number of tradeoffs, but the general consensus is that to reach the higher levels of performance ... » read more

The Challenge Of Optimizing Chip Architectures For Workloads
By Brian Bailey - 12 May, 2022 - Comments: 1

It isn't possible to optimize a workload running on a system just by looking at hardware or software separately. They need to be developed together and intricately intertwined, an engineering feat that also requires bridging two worlds with have a long history of operating independently. In the early days of computing, hardware and software were designed and built by completely separate team... » read more

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