To 10nm And Beyond

By Mark LaPedus - 20 Oct, 2016 - Comments: 0

Hong Hao, senior vice president of the foundry business at Samsung Semiconductor, sat down with Semiconductor Engineering to discuss the future direction of transistors, process technology, lithography and other topics. What follows are excerpts of those conversations. SE: Samsung recently rolled out its 10nm finFET technology. It appears that Samsung is the world’s first company to ship 1... » read more

5 Takeaways From BACUS

By Mark LaPedus - 22 Sep, 2016 - Comments: 0

As usual, the recent SPIE Photomask Technology Conference, sometimes called BACUS, was a busy event. The event, which took place in San Jose, Calif., featured presentations on the usual subjects in the photomask sector. There were presentations on mask writers, inspection, metrology, repair and cleaning. And, of course, the papers included masks based on extreme ultraviolet (EUV) lithography... » read more

Trade War Looms Over Materials

By Mark LaPedus - 18 Aug, 2016 - Comments: 1

It’s time to pay close attention to rare earths and raw materials--again. In fact, the supply chain teams and commodity buyers at aerospace, automotive and electronics companies may have some new and potentially big problems on their hands. For some time, the European Union (EU), the United States and other nations have been at odds with China over rare earths. China, which accounts for... » read more

5 Takeaways From Semicon

By Mark LaPedus - 21 Jul, 2016 - Comments: 0

As usual, the recent Semicon West trade show was a busy, if not an overwhelming, event. The event, which took place in San Francisco in early July, featured presentations on the usual subjects in the semiconductor and IC-equipment sectors. There were sessions on 200mm, next-generation processes, transistors, lithography, MEMS and many others. In no particular order, here are my five ta... » read more

How Will 5G Work?

By Mark LaPedus - 23 Jun, 2016 - Comments: 0

Sumit Tomar, general manager of the Wireless Infrastructure Products Group at RF chip giant Qorvo, sat down with Semiconductor Engineering to discuss the development of next-generation 5G wireless networks and other topics. In 2014, RF Micro Devices and TriQuint merged to form Qorvo. What follows are excerpts of that conversation. SE: 5G, the follow-on to the current wireless standard known ... » read more

What’s The Outlook For ICs?

By Mark LaPedus - 19 May, 2016 - Comments: 1

As the semiconductor industry heads into the second half of 2016, it’s time to take the pulse of the IC sector. Based on the current signs, there’s a faint pulse, if that. Simply put, the IC market has been in the doldrums in the first half of 2016. And it looks sluggish heading into the second half. It wasn’t supposed to be like this. At the beginning of this year, many predicte... » read more

Insider’s Guide To Fab Technology

By Mark LaPedus - 21 Apr, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss fab technology with Matt Paggi, vice president of advanced technology development at GlobalFoundries. What follows are excerpts of that conversation. SE: What’s driving demand for semiconductors today? Paggi: You are aware of what the worldwide semiconductor revenue growth is this year. There are peaks and valleys in the worldwide semiconduc... » read more

Insider’s Guide To Photomasks

By Mark LaPedus - 17 Mar, 2016 - Comments: 1

Semiconductor Engineering sat down to talk about photomasks and lithography with Franklin Kalk, executive vice president of technology at Toppan Photomasks, a merchant photomask supplier. What follows are excerpts of that conversation. SE: What’s hot in mask technology these days? Kalk: It’s everything from the bleeding-edge like EUV to much more mature manufacturing. On the mature si... » read more

An Insider’s Guide To Planar And 3D DRAM

By Mark LaPedus - 18 Feb, 2016 - Comments: 0

Semiconductor Engineering sat down to talk about planar DRAMs, 3D DRAMs, scaling and systems design with Charles Slayman, technical leader of engineering at network equipment giant Cisco Systems. What follows are excerpts of that conversation. SE: What types of DRAM do network equipment OEMs look at or buy these days? Slayman: When we look at DRAM, we look at it for networking applicatio... » read more

Inside AI And Deep Learning

By Mark LaPedus - 21 Jan, 2016 - Comments: 0

Semiconductor Engineering sat down to talk with Dave Schubmehl, research director for content analytics, discovery and cognitive systems at International Data Corp. (IDC), a market research firm. Schubmehl’s research covers information access, artificial intelligence, cognitive computing, deep learning, machine learning and other topics. He also addressed neuromorphic technology. What follows... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.