Tech Talk: Earlier Software

By Ed Sperling - 02 Nov, 2016 - Comments: 0

Malte Doerper, senior manager of product management at Synopsys, talks about the big "shift left" for software, where the problems crop up, and how to save as much as a year of development time with automation and better methodologies. Related Stories Bridging Hardware And Software The need for concurrent hardware-software design and verification is increasing, but are engine... » read more

Tech Talk: ADAS

By Ed Sperling - 23 Mar, 2016 - Comments: 0

Kurt Shuler, vice president of marketing at Arteris, explains what the Advanced Driver Assistance Systems standard is, where the problems are, and why this is becoming so important in automotive semiconductor design. » read more

Tech Talk: 2.5D Issues

By Ed Sperling - 25 Feb, 2016 - Comments: 0

Bill Isaacson, director of ASIC marketing at eSilicon, about how viable this packaging approach is, organic vs. inorganic interposers, where the problems are, thermal coupling, interposer cost, and what will change over the next couple years. » read more

Tech Talk: ISO 26262

By Ed Sperling - 24 Feb, 2016 - Comments: 0

Arteris' Kurt Shuler talks about the automotive design standard, how it applies to semiconductors, and where engineers run into problems. » read more

Tech Talk: SoC Protocol Debug

By Ed Sperling - 24 Sep, 2015 - Comments: 0

Bernie DeLay, group director for verification IP R&D at Synopsys, talks about what goes wrong in complex SoCs, how so-called standard pieces play together, and where are the gotchas in re-use. [youtube vid=AaY_AmdjUpo] » read more

Tech Talk: USB Type-C

By Ed Sperling - 30 Jul, 2015 - Comments: 1

NXP's Ravi Shah explains how to design in the new USB standard, what to watch out for and why it's going to be so important for mobile and connected devices. [youtube vid=iPCwpaPy1pw] » read more

Tech Talk: Power Tools

By Ed Sperling - 27 May, 2015 - Comments: 0

At 200 million gates, using standard tools for power will add weeks to the semiconductor design process. Vijay Chobisa, product marketing manager at Mentor Graphics, talks with Semiconductor Engineering about where the problems are and how to solve them. [youtube vid=w7yEdtaIb9A] » read more

Tech Talk: Faster SPICE

By Ed Sperling - 04 May, 2015 - Comments: 0

ProPlus CTO Bruce McGaughy explains why FastSPICE (fast Simulation Program with Integrated Circuit Emphasis) is running out of steam in the finFET generation and what needs to happen next. [youtube vid=07XzUQxPUr8] » read more

Tech Talk: Virtual Prototyping

By Brian Bailey - 22 Apr, 2015 - Comments: 0

Bill Neifert, CTO of Carbon Design Systems, talks with about the intersection of IP and EDA, driven in particular by ARM's new architecture. [youtube vid=1OopYWmRarE] » read more

Tech Talk: IoT Design Changes

By Ed Sperling - 25 Mar, 2015 - Comments: 0

eSilicon's Lisa Minwell talks with Semiconductor Engineering about what's needed to push Internet of Things designs down to the microwatt range, and how to bridge the gap between what's available today and what's needed for the future. [youtube vid= bk3BgtJnFpg] » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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