New Memory Options

By Ed Sperling - 28 Feb, 2019 - Comments: 0

Carlos Macián, eSilicon’s senior director of AI strategy and products, talks about how to utilize memory differently and reduce the movement of data in AI chips, and what impact that has on power and performance. https://youtu.be/wItp6wReVts » read more

Reverse Debug

By Ed Sperling - 28 Feb, 2019 - Comments: 0

Chun Chan, product applications engineering director at Synopsys, talks with Semiconductor Engineering about testbench debug and how adding time markers can speed time to signoff. https://youtu.be/tx_89M1bq3Q » read more

More Than A Core

By Ann Mutschler - 20 Dec, 2018 - Comments: 0

Gajinder Pandesar, CTO of UltraSoC, talks with Semiconductor Engineering about why heterogeneous design is changing the starting point for chip design, and why integration is now the real challenge rather than the processor core. https://youtu.be/y0rzopp5HDI » read more

Formal Signoff

By Ed Sperling - 04 Dec, 2018 - Comments: 0

Xiaolin Chen, senior AE at Synopsys, looks at what’s good enough coverage, what makes one assertion better than another, and where the potential holes are in verification. https://youtu.be/nBtKE0gDHBU » read more

Heterogeneous Computing Verification

By Ed Sperling - 28 Nov, 2018 - Comments: 0

Raik Brinkmann, CEO of OneSpin Solutions, looks at new architectures involving AI and machine learning, what changes in these multi-accelerator, multi-memories designs, and where problems can crop up both in design and verification. https://youtu.be/0Trtfq8_hKg See other tech talk videos here. » read more

Formal Datapath Verification

By Ed Sperling - 28 Nov, 2018 - Comments: 0

J.T. Longino, formal verification application engineer at Synopsys, drills down into how to achieve confidence in datapath designs by applying formal solvers and methods to data transformation areas of a design rather than the control path areas. https://youtu.be/n1zO3GxEZVI See other tech talk videos here. » read more

Building AI SoCs

By Ed Sperling - 25 Oct, 2018 - Comments: 0

Ron Lowman, strategic marketing manager at Synopsys, looks at where AI is being used and how to develop chips when the algorithms are in a state of almost constant change. That includes what moves to the edge versus the data center, how algorithms are being compressed, and what techniques are being used to speed up these chips and reduce power. https://youtu.be/d32jtdFwpcE ... » read more

Using High-Bandwidth Memory

By Ed Sperling - 01 Oct, 2018 - Comments: 0

eSilicon’s Tim Horel talks about HBM, what engineers need to know to work with this technology, and how it integrates with ASICs at advanced nodes. https://youtu.be/0Yq2XHGF6UE » read more

Planning Out Verification

By Ed Sperling - 28 Sep, 2018 - Comments: 0

OneSpin Solutions’ Nicolae Tusinschi talks with Semiconductor Engineering about how to move from specification to signoff in a verification flow. https://youtu.be/2zrgaq2I1SQ » read more

Thermal Impact On Reliability At 7/5nm

By Ed Sperling - 28 Sep, 2018 - Comments: 0

Haroon Chaudhri, director of RedHawk Analysis Fusion at Synopsys, talks about why thermal analysis is shifting left in the design cycle and why this is so critical at the most advanced process nodes. https://youtu.be/wjkrEFLb2vY » read more

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Knowledge Centers
Entities, people and technologies explored

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3.5D: The Great Compromise

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