Variation At 10/7nm


Klaus Schuegraf, vice president of new products and solutions at PDF Solutions, explains why variability is a growing challenge at advanced nodes, why middle of line is now one of the big problem areas, and what happens when a via is misaligned due to a small process variation. https://youtu.be/jQfggOnxZJQ » read more

What Is SOTIF?


Arteris IP’s Kurt Shuler discusses new system-level best-practices approach to automotive design that will be used for both diagnostics and forensics when something goes wrong with autonomous vehicles. https://youtu.be/nC3TkF7c0Oo » read more

Using ASICs For AI Inferencing


Flex Logix’s Cheng Wang looks at why ASICs are the best way to improve performance and optimize power and area for inferencing, and how to add flexibility into those designs to deal with constantly changing algorithms and data sets. https://youtu.be/XMHr7sz9JWQ » read more

5G Test And Deployment


Advantest’s Adrian Kwan talks about 5G test, how it will change as the wireless technology evolves toward higher frequency signals, and what happens when many more users and backward compatibility are added to the network. https://youtu.be/x_-3yX7fWak » read more

Variability In Chip Manufacturing


Brewer Science’s Jim Korich talks about how to deal with variability in processes and why consistency in materials is so important at advanced nodes. https://youtu.be/U1KkUmtmqpE » read more

The Next Big Chip Companies


Rambus’ Mike Noonen looks at why putting everything on a single die no longer works, what comes after Moore’s Law, and what the new business model looks like for chipmakers. https://youtu.be/X6Kca8Vm-wA » read more

eFPGA vs. FPGA Design Methodologies


Namit Varma, senior director of Achronix’s India Technology Center, discusses the differences between discrete and embedded FPGAs. https://youtu.be/Vwo3ktQvcKc » read more

Using High-Bandwidth Memory


eSilicon’s Tim Horel talks about HBM, what engineers need to know to work with this technology, and how it integrates with ASICs at advanced nodes. https://youtu.be/0Yq2XHGF6UE » read more

Planning Out Verification


OneSpin Solutions’ Nicolae Tusinschi talks with Semiconductor Engineering about how to move from specification to signoff in a verification flow. https://youtu.be/2zrgaq2I1SQ » read more

Thermal Impact On Reliability At 7/5nm


Haroon Chaudhri, director of RedHawk Analysis Fusion at Synopsys, talks about why thermal analysis is shifting left in the design cycle and why this is so critical at the most advanced process nodes. https://youtu.be/wjkrEFLb2vY » read more

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