Chip packaging for military and aerospace applications must meet stringent requirements for robustness, longevity and cost savings. Open-cavity plastic packaging has a proven history and a bright future for this market.
Ceramic packages were, for many years, the option of choice for semiconductor prototype assembly, particularly in military-aerospace applications. They are able to withstand high temperatures and can be hermetically sealed. However, they can be costly and, while they allow for rapid assembly of first samples, the final product is typically a plastic package, so the ceramic prototype doesn’t offer an accurate representation. This need for a better, more viable alternative to ceramic was one of the catalysts that gave rise to open-cavity plastic packaging (OCPP). OCPP is the ideal platform for new IC prototypes because the packages are mechanically and electrically identical to a chipmaker’s future transfer molded production parts. They can be prepared in advance and stored for assembly as soon as the wafers and/or die are ready. OCPP is made to withstand the test of time. This paper looks at the benefits and advantages of OCPP and describes a real-world project that illustrates why utilizing OCPP for device designs offers a cost-effective solution for low- to mid-volume packaging destined for mil-aero end applications.
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