A new technical paper titled “A Comparative Study on Various Au Wire Rinse Compositions and Their Effects on the Electronic Flame-Off Errors of Wire-Bonding Semiconductor Package” was published by researchers at Hanbat National University, Seoul National University and Chungnam National University.
The paper states:
“In this study, we identify the origin of electronic flame-off (EFO) errors based on the type of rinse applied for the surface treatment of gold (Au) wires in the wire-bonding semiconductor packaging process. Hydrocarbon and silicone surfactants are commonly used for Au wire surface treatment, and five different 1.0 wt% rinse solutions with varying compositions are applied to the Au wire surface. To determine the origin of EFO errors, an experiment is conducted to examine the reactivity of the rinse-coated Au wires with silicon (Si)-containing dust, which is inevitably generated in the wire-bonding process. “
Find the technical paper here. March 2025.
J. Lim et al., “A Comparative Study on Various Au Wire Rinse Compositions and Their Effects on the Electronic Flame-Off Errors of Wire-Bonding Semiconductor Package,” in IEEE Access, doi: 10.1109/ACCESS.2025.3551884.
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