Film Failure in Multilayer Systems for Semiconductor Devices


Researchers at MIT, Yonsei University (Seoul, Korea) just published this technical paper titled “Interfacial Delamination at Multilayer Thin Films in Semiconductor Devices.”

According to the abstract “In this work, the effect of thermomechanical stress on the failure of multilayered thin films on Si substrates was studied using analytical calculations and various thermomechanical tests.”

Find the technical paper here. Published July 2022.

Jin-Hoon Kim, Hye-Jun Kil, Sangjun Lee, Jinwoo Park, and Jin-Woo Park
ACS Omega Article ASAP
DOI: 10.1021/acsomega.2c02122

Visit Semiconductor Engineering’s Technical Paper library here and discover many more chip industry academic papers.

Leave a Reply

(Note: This name will be displayed publicly)