Fluid dispensing systems are evolving to address the challenges that SiP and MEMS packages face, especially in tight geometries and assembly processes.
Fluid dispensing systems are evolving in order to address the challenges that system-in-package (SiP) and micromechanical systems (MEMS) packages face, especially in regard to tight geometries and assembly processes.
These packages, used in smartphones, have become more miniaturized, and as a result, have created added value in the market. However, they include a variety of small dies or devices inside, including RFICs, MEMS, application specific ICs (ASICs), discrete passives, and others, which are more tightly allocated in the package. The dispensing system has to dispense various fluids, including underfill, solder paste, flux, and encapsulation, into tight locations and onto smaller pads in order to fit the device size
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