A look at the Pathfinder solution and why ESD is becoming so important to consider at advanced nodes.
ESD or electro-static discharge induced field failures for integrated circuits (IC) has always been an challenge. Literature survey indicates that as high as 35% of total chip field failures are ESD related. Several trends in the IC industry are exacerbating the impact of ESD induced failures: (a) move towards advanced processing technologies with shrinking geometries, (b) push for higher levels of digital and analog integration on the same die with several isolated and independent power and ground networks, (c) proliferation of hand-held devices resulting in more direct access to IC components, and (d) advanced package designs with tighter pitch, fewer layers, and complex shapes.
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