Analyzing The Integrity Of Power


Power analysis is shifting much earlier in the chip design process, with power emerging as the top design constraint at advanced process nodes. As engineering teams pack more functionality and content into bigger and more complex chips, they are having to deal with more complex interactions that affect everything from power to its impact on signal integrity and long-term reliability. That, i... » read more

Upcoming Hurdles For The Semiconductor Industry


Semiconductor Engineering sat down to discuss upcoming challenges and hurdles to overcome for the semiconductor industry with Vic Kulkarni, senior vice president and general manager, RTL Power Business at Ansys-Apache; Chris Rowen, Fellow and CTO, IP Group at Cadence; Subramani Kengeri, vice president, Global Design Solutions at GLOBALFOUNDRIES; Simon Davidmann, CEO of Imperas Software; Michael... » read more

Low Power Design Analysis


This paper presents a methodology for comprehensive power grid verification coverage, including identification of power grid weaknesses early in the design cycle. To read more, click here. » read more

Why Packaging Matters


The semiconductor package is changing. What was until very recently considered an afterthought is now becoming a key part of the design process at all major chipmakers, and a critical factor in the extension of Moore's Law. This is a sharp reversal of what was almost universally an afterthought in planar silicon design and manufacturing. Rarely was the package an integral part of the archite... » read more

Do Circuits Whisper Or Shout?


Maximizing SoC performance and minimizing power is becoming a multi-layered and multi-company challenge that depends on everything from ecosystem feedback and interactions to micro-architectural decisions about whether analog circuits whisper or shout. What used to be a straightforward architectural tradeoff between performance and power has evolved into a much more diffuse and collaborativ... » read more

Upcoming Hurdles For The Semiconductor Industry


Semiconductor Engineering sat down to discuss upcoming challenges and hurdles to overcome for the semiconductor industry with Vic Kulkarni, senior vice president and general manager, RTL Power Business at Ansys; Chris Rowen, Fellow and CTO, IP Group at Cadence; Subramani Kengeri, vice president, Global Design Solutions at GLOBALFOUNDRIES; Simon Davidmann, CEO of Imperas Software; Michael Buehle... » read more

Making Cars Smarter


The fuel injection control unit has come a long way since 1983 when Ford Motor Co. first included a 16-bit Intel microcontroller-based fuel injection system in its 4-cylinder Escort. Today, some high end vehicles contain more than 100 microprocessors, which is mind boggling in comparison to that Escort that contained just one. To be sure, the automotive industry is a unique animal. Compared ... » read more

Power Requires Holistic Perspective


With the move to smaller manufacturing nodes, power must be looked at from a holistic perspective. Instead of just optimizing a device or devising next generation power gating, power must be considered in the context of the whole system, Aveek Sarkar, vice president of product engineering and support at Ansys/Apache mentioned during a recent discussion about 5nm. In fact, he said, this c... » read more

First Look: 5nm


By the time the 5nm semiconductor manufacturing process node reaches mass production readiness, the hurdles and challenges will no longer be open for discussion. But as of this moment, some of them seem almost insurmountable, raising new questions about the continued viability of Moore's Law. There has been much written about the end of [getkc id="74" comment="Moore's Law"] for nearly two de... » read more

Thermal Issues Getting Worse


Making sure that smartphone you’re holding doesn’t burn your face when you make a call requires a tremendous amount of engineering effort at all levels of the design - the case, the chips, the packaging. The developers of the IP subsystems in that smartphone must adhere to very strict power and energy thresholds so the OEM putting it all together can stick to some semblance of a product des... » read more

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