HBM3 Memory: Break Through To Greater Bandwidth

How the HBM standard evolved and what features are in Rambus’ HBM3-ready memory subsystem.


AI/ML’s demands for greater bandwidth are insatiable driving rapid improvements in every aspect of computing hardware and software. HBM memory is the ideal solution for the high bandwidth requirements of AI/ML training, but it entails additional design considerations given its 2.5D architecture. Now we’re on the verge of a new generation of HBM that will raise memory and capacity to new heights. Designers can realize new levels of performance with the HBM3-ready memory subsystem solution from Rambus.

This white paper will present the evolution of HBM standard, design challenges and considerations, and features of Rambus HBM3-ready memory subsystem.

Click here to read more.

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