New approaches for designing complex and extremely large AI and automotive chips.
Embarking on advanced SoCs without a smart design-for-test (DFT) strategy can be harmful to your bottom line. Being competitive in today’s semiconductor market means adopting integrated, scalable, and flexible solutions to cut DFT implementation time, test costs, and time-to-market. Tessent DFT technologies, developed in partnership with industry leaders, provide the most advanced DFT and yield solutions available. This paper describes the most significant areas of Tessent DFT research and development that enable semiconductor companies to produce competitive products. We include examples of how Tessent solutions are being applied to some of today’s most challenging designs, like extremely large artificial intelligence (AI) processors and ICs for automotive applications.
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