Verification Pilgrims Show A Historical Case For DFT


The Mayflower Steps, where the Pilgrims are believed to have embarked on their journey to America, are located in the beautiful Barbican area of Plymouth, a small town in the southwest of England. As the lone American working for Moortec, a British company based in Plymouth, I stood and stared at them this past September. Separated by a few yards of distance but 399 years of history I found my... » read more

A Breakthrough In Silicon Bring-Up


The current semiconductor market is seeing increasingly complex silicon devices for applications like 5G wireless communications, autonomous driving, and artificial intelligence. One of the ways designers are working to control design time and cost is through the adoption of IJTAG (IEEE 1687) for a plug-and-play style IP integration during design. The benefits of using IJTAG are still emerging,... » read more

Simplifying Silicon Bring-Up And Debug On ATE equipment With ATE-Connect


The silicon bring-up process is ripe for improvement. Tessent SiliconInsight with ATE-Connect technology eliminates communication barriers between proprietary tester-specific software and DFT platforms, which accelerates debug of IJTAG devices, speeds product ramps, and reduces time-to-market for products in 5G wireless communications, autonomous driving, and artificial intelligence. Read mo... » read more

The Single Best DFT Move You Can Make


A proven method to simplify a complex problem is to break it into smaller chunks. In the case of today’s large, complex SoCs, this means using hierarchical methods to design the blocks, then combine the results at the top level. While this sounds obvious, it hasn’t always been practical or technologically feasible to perform some tasks, like DFT, at the block level and translate that work s... » read more

Hierarchical DFT: Proven Divide-And-Conquer Solution Accelerates DFT Implementation And Reduces Test Costs


Implementation of the most challenging DFT tasks is greatly simplified by the proven and widely-adopted automation available in Tessent products. This whitepaper describes the basic components of an RTL-based hierarchical DFT methodology, the benefits that it provides, and the tool automation that is available through Mentor’s Tessent products. The focus is on the techniques and automation of... » read more

The Great Test Blur


As chip design and manufacturing shift left and right, concerns over reliability are suddenly front and center. But figuring out what exactly what causes a chip to malfunction, or at least not meet specs for performance and power, is getting much more difficult. There are several converging trends here, each of which plays an integral role in improving reliability. But how significant a role... » read more

Hierarchical DFT On A Flat Layout Design


The use of hierarchical DFT methods is growing as design size and complexity stresses memory requirements and design schedules.  Hierarchical DFT divides the design into smaller pieces, creates test structures and patterns at the core level, then retargets the core patterns to the chip level. But, if you need to perform the physical place and route on the full flat design, can you still take a... » read more

ON Semiconductor Reduces Memory BiST Insertion Time By 6X With Tessent Hierarchical Flow


This paper describes a case study on the insertion of memory BiST for an ON Semiconductor multi-million gate-level netlist with 300 memory instances. The physical implementation will be done using a flat layout. Two different methodologies can be applied when it comes to physical implementation; hierarchical or fullflat. When performing physical implementation as full-flat flow, typically the D... » read more

Meeting ISO 26262 Requirements Using Tessent IC Test Solutions


As the industry moves towards greater automation in vehicles, suppliers of the ICs used to drive the automotive electronic systems are rapidly adopting solutions to meet ISO 26262 requirements. The Tessent family of IC test products offers the highest defect coverage, in-system non-destructive memory test, hybrid ATPG/Logic BIST, and analog test coverage measurement. These technologies add up t... » read more

BiST Grows Up In Automotive


Test concepts and methods that have been used for many years in traditional semiconductor and SoC design are now being leveraged for automotive chips, but they need to be adapted and upgraded to enable monitoring of advanced automotive systems during operation of a vehicle. Automotive and safety critical designs have very high quality, reliability, and safety requirements, which pairs pe... » read more

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