Controlling the upper tilt distance is more important for offering a larger visible area.
A virtual DOE-based process sensitivity check was performed for two tiers of channel holes in a 3D NAND device. The channel hole tilt distance, twist angle, and their sensitivities to the visible area in silicon-oxide-nitride-oxide (SONO) punch process were analyzed. The results show that controlling the upper tilt distance is more important for offering a larger visible area. Also, a negative tilt distance difference and a closer twist angle between the upper and lower channel holes offer a good choice for providing larger visible punch area.
Authors:
Coventor, Inc., A Lam Research Company, Shanghai, China: Qingpeng Wang, Pengfei Lyu, Lifei Sun, Yu De Chen, Cheng Li, Jacky Huang, Benjamin Vincent, and Joseph Ervin.
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Q. Wang, et al., “Important Process Parameter and Its Sensitivity Check By Virtual Fabrication: Channel Hole Profile Impact On Advanced 3D NAND Structure,” 2023 China Semiconductor Technology International Conference (CSTIC), Shanghai, China, 2023, pp. 1-3, doi: 10.1109/CSTIC58779.2023.10219288.
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