This e-book explores microstrip antenna design, highlighting the single-element rectangular microstrip antenna and antenna arrays constructed from single microstrip elements.
A significant performance element in communication and radar systems, as well as wireless devices, is the antenna, which may be defined as a transducer between a guided electromagnetic (EM) wave propagating along a transmission line, and an EM wave propagating in an unbounded medium (usually free space) or vice-versa.1 The antenna is required to transmit or receive EM energy with directional and polarization properties suitable for the intended application. This eBook explores the radiation properties of rectangular microstrip antennas; specifically, the radiation method, coupling of the feed structure to the microstrip radiating element – or elements in the case of array structures – and the simple transmission line model utilized for design and performance estimates. In Part 1, the single element, rectangular microstrip antenna is explored. Part 2 examines the properties of antenna arrays constructed from the ensemble of single microstrip elements.
The material presented in this eBook comes from a technical tutorial written by Kenneth Puglia, principal at E x H Consulting Services, a company specializing in radar sensor systems, frequency synthesis, and frequency conversion. Kenneth is a former fellow of technology at M/A COM and a design engineer at Radio Corporation of America (RCA). He holds a BSEE from the University of Massachusetts and an MSEE from Northeastern University.
Click here to access the e-book.
Steps are being taken to minimize problems, but they will take years to implement.
AMD CTO Mark Papermaster talks about why heterogeneous architectures will be needed to achieve improvements in PPA.
Companies are speeding ahead to identify the most production-worthy processes for 3D chip stacking.
New capacity planned for 2024, but production will depend on equipment availability.
Number of options is growing, but so is the list of tradeoffs.
Increased transistor density and utilization are creating memory performance issues.
Suppliers are investing new 300mm capacity, but it’s probably not enough. And despite burgeoning 200mm demand, only Okmetic and new players in China are adding capacity.
The industry reached an inflection point where analog is getting a fresh look, but digital will not cede ground readily.
100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Different interconnect standards and packaging options being readied for mass chiplet adoption.
Disaggregation and the wind-down of Moore’s Law have changed everything.
Steps are being taken to minimize problems, but they will take years to implement.
Leave a Reply