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Modeling Of The Electrical Performance Of The Power And Ground Supply For A PC Microprocessor On A Card

How to achieve low power with minimal resonance inside the package.

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The electrical characteristics of the power and ground supply of a PC microprocessor packaged in a Ball Grid Array (BGA) package mounted on a card are studied by dynamic electromagnetic field analysis. The effects of decoupling capacitors of different types and at different locations are investigated to achieve the objectives of low power and ground impedance and no or insignificant resonances inside the package.

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