Multi-Die Integration

Advantages and challenges for heterogeneous integration in advanced packaging.


Putting multiple heterogeneous chips is the way forward for improved performance and more functionality, but it also brings a host of new challenges around partitioning, layout, and thermal. Michael Posner, senior director for die-to-die connectivity at Synopsys, talks about the advantages of 3D integration, why it’s finally going mainstream, and what’s needed in the EDA tools to make this as straightforward as chip-to-chip integration.

Related Reading
Designing For Multiple Die
Why a system-level approach is essential, and why it’s so challenging

Leave a Reply

(Note: This name will be displayed publicly)