A new technical paper titled “Double cantilever beam bonding energy measurement using confocal IR microscopy” was published by researchers at Univ. Grenoble Alpes, CEA-LETI and SOITEC, Parc Technologique des Fontaines.
“A new technique is assessed in order to measure, at the wafer scale, direct bonding energies. It is derived from the standard Double Cantilever Beam (DCB) method and uses interferometry in confocal IR laser source microscopy to measure crack openings,” states the paper.
Find the technical paper here. Published December 2022.
L. Colonel, A. Calvez, F. Fournel, V. Larrey, S. Moreau, F. Mazen, and F. Rieutord , “Double cantilever beam bonding energy measurement using confocal IR microscopy”, Journal of Applied Physics 132, 215106 (2022) https://doi.org/10.1063/5.0114668.
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