New Package Solutions for Automotive Optical Sensors

New optical ball grid array (OBGA) packaging platform for automotive applications.

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This article introduces the development of a new optical ball grid array (OBGA) packaging platform designed for automotive applications, with a focus on platform development and compliance with the Automotive Electronics Council (AEC) AEC-Q100 Grade 2 reliability standard. The proposed packaging solution extends beyond traditional cavity OBGA packages, which have been primarily utilized for microelectromechanical systems (MEMS) and sensor applications .

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