What’s the gorilla in the room and how does it affect the push toward stacked die?
For the past few years, the most popular topics in the 2.5D space have been:
The industry is at the point where the open variables on these topics are narrowing, and other critical aspects need to get far better attention. The new product introduction (NPI) process for heterogeneous 2.5D devices opens up a lot of possibilities but also creates many complications that need to be considered early in the process.
The focus now needs to shift toward:
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