tag: ARM

Software-Hardware Co-Design Becomes Real
By Brian Bailey - 27 Sep, 2021 - Comments: 1

For the past 20 years, the industry has sought to deploy hardware/software co-design concepts. While it is making progress, software/hardware co-design appears to have a much brighter future. In order to understand the distinction between the two approaches, it is important to define some of the basics. Hardware/software co-design is essentially a bottom-up process, where hardware is deve... » read more

Week In Review: Design, Low Power
By Jesse Allen - 24 Sep, 2021 - Comments: 0

U.S. government officials met with semiconductor industry companies and automakers to request supply chain information it hopes could address the current semiconductor shortage, Reuters reports. Secretary of Commerce Gina Raimondo hopes the information will enable them and industry to "get more granular into the bottlenecks and then ultimately predict challenges before they happen," but also wa... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 24 Sep, 2021 - Comments: 0

Automotive Cadence announced its new platform for speeding up the creation of virtual and hybrid prototypes of complex systems, such as those found in automotive systems. The Cadence Helium Virtual and Hybrid Studio enables teams to verify embedded software and firmware on virtual and hybrid configurations before the RTL is ready, in systems where software and hardware need to be created simul... » read more

Data Tsunami Pushes Boundaries Of IC Interconnects
By Ann Mutschler - 22 Sep, 2021 - Comments: 0

Rapid increases in machine-generated data are fueling demand for higher-performance multi-core computing, forcing design teams to rethink the movement of data on-chip, off-chip, and between chips in a package. In the past, this was largely handled by the on-chip interconnects, which often were a secondary consideration in the design. But with the rising volumes of data in markets ranging fro... » read more

Blog Review: Sept. 22
By Jesse Allen - 22 Sep, 2021 - Comments: 0

Ansys' Tyler Ferris describes some of the many ways electronics on a PCB assembly can fail, from component level failures like wirebond breaking and liftoff to board-level failures such as conductive anodic filament failure. Cadence's Paul McLellan considers the switch from low-speed parallel interfaces to high-speed serial interfaces as one of the key advancements making modern data centers... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 17 Sep, 2021 - Comments: 0

Packaging and test Advantest and PDF Solutions have launched their first jointly developed offering since forming a partnership in 2020. The new product is called the Advantest Cloud Solutions Dynamic Parametric Test (ACS DPT) solution. It integrates PDF Solutions’ Exensio portfolio of data analytics with Advantest’s V93000 Parametric Test System. The ACS DPT solution is designed to op... » read more

Week In Review: Design, Low Power
By Jesse Allen - 17 Sep, 2021 - Comments: 0

MoSys, a provider of SRAM solutions and networking accelerators, and Peraso Technologies, a provider of 5G mmWave devices, are merging. Stockholders of Peraso are expected to hold a 61% equity interest in the combined company, with the remaining 39% equity interest to be retained by the stockholders of MoSys. Peraso CEO Ronald Glibbery said, "By joining with MoSys, we believe we can deliver a b... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 17 Sep, 2021 - Comments: 0

Automotive Arm announced a new software architecture, two reference hardware implementations, and its role leading a new industry group that will work on open-source software for automotive use. The Scalable Open Architecture for Embedded Edge (SOAFEE) is based on Arm’s Project Cassini and SystemReady, aims to help the automotive industry move to software-defined systems by tackling the comp... » read more

Blog Review: Sept. 15
By Jesse Allen - 15 Sep, 2021 - Comments: 0

Synopsys' Ian Land and Ricardo Borges examine how radiation modeling can help ensure semiconductor components will survive while housed in equipment that is orbiting our planet or traveling through deep space over extensive periods of time. Siemens EDA's Rich Edelman explores why writing coverage is an art requiring imagination, practice, and patience, along with some tips on how to improve.... » read more

Long-Haul Trucking With Fewer Drivers
By Ann Mutschler - 13 Sep, 2021 - Comments: 1

The trucking industry is betting heavily on increasing levels of autonomy and electrification to reduce the cost of moving goods and to overcome persistent problems. The economics of autonomous driving are compelling, not least of which is an almost perpetual shortage of qualified drivers. But there also are a number of technical hurdles to making this work. On top of the challenges facing t... » read more

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