Preparing For The Multiphysics Future Of 3D ICs
Materials, thermal analysis, and shift left strategies for multi-die packages.
3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, power efficiency and cost, 3D ICs are poised to transform the landscape of electronic devices. However, with 3D ICs come new design and verification challenges that must be addressed to ensure successful implementation.
The primary challenge is ensuring that active chiplets in a 3D IC assembly behave electrically as intended. Designers must start by defining the 3D stack-up so that design tools can understand the connectivity and geometric interfaces across all components in the assembly. This definition also drives automation of cross-die parasitic coupling impacts, laying the groundwork for 3D-level analysis of thermal and stress impacts.
What you’ll learn:
- Multiphysics challenges in 3D ICs involve managing the combined impacts of electrical, thermal, and mechanical phenomena, which are more complex than in 2D IC designs.
- New materials used in 3D ICs introduce unpredictable behaviors, requiring updated design methodologies that account for vertical stacking and interconnects.
- Thermal analysis is critical because heat buildup in 3D ICs impacts not just electrical performance but also mechanical integrity, which can compromise reliability.
- Shift-left strategies help reduce costly late-stage rework by introducing multiphysics analysis early and continuously throughout the design process.
- Iterative design ensures optimal outcomes by refining decisions over time as more precise data on materials, power distribution, and coupling impacts become available.
Who should read this:
- IC designers focused on chiplet or 3D IC design
- Package designers creating any type of multi-die advanced package
- Anyone interested in advances in 3D IC design technology
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