Where Is The Software For Shift Left?


Co-development of hardware and software has been a dream for a long time, but significant hurdles remain. Neither domain is ready with what the other requires at the appropriate time. The earlier something can be done in a development flow, the less likely problems will be found when they are more difficult or expensive to fix. It may require both tool and methodology changes, so that a proc... » read more

Shift Left Strategy For Semiconductor Production Testing


In the fast-paced world of semiconductor manufacturing, achieving higher yields and reducing costs are constant challenges. Ideally, yield should only be impacted by unavoidable defects when everything else is performing as expected. However, when yield reduction occurs due to the process sensitivity of the design, these issues can be detected and, in many cases, corrected. proteanTecs has d... » read more

How To Speed Up LVS Verification


Layout versus schematic (LVS) comparison is a crucial step in integrated circuit (IC) design verification, ensuring that the physical layout of the circuit matches its schematic representation. The primary goal of LVS is to verify the correctness and functionality of the design. Traditionally, LVS comparison is performed during signoff verification, where dedicated tools compare layout and sche... » read more

Shift Left Is The Tip Of The Iceberg


Shift left is evolving from a buzzword into a much broader shift in design methodology and EDA tooling, and while it's still early innings there is widespread agreement that it will be transformative. The semiconductor industry has gone through many changes over the past few decades. Some are obvious, but others happen because of a convergence of multiple factors that require systemic change... » read more

Preparing For The Multiphysics Future Of 3D ICs


3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, power efficiency and cost, 3D ICs are poised to transform the landscape of electronic devices. However, with 3D ICs come new design and verification challenges that must be addressed to ensure success... » read more

Boost High-Performance IC Design Flows With Early Interactive Symmetry Checking


In the realm of high-performance IC (integrated circuit) design, symmetry is not just an aesthetic preference—it’s a critical factor for ensuring proper device functionality, especially in analog and RF designs. Achieving symmetry early in the design process helps to ensure consistent electrical behavior, which is essential for meeting performance goals and maintaining device reliability. H... » read more

Shift Left The Design Process With Calibre Interactive Symmetry Checking


The traditional methods of symmetry checking are due for an update. The Calibre interactive, no code symmetry checking solution helps designers capture symmetry issues very early in the design cycle to reduce the number of iterations. Calibre interactive symmetry checking shifts left the whole verification process and reduces the time needed to reach tape out. What you’ll learn: Why the... » read more

How The Semiconductor Ecosystem Is Responding To Its Global Challenges


The semiconductor industry is changing rapidly, with government support for re-shoring capacity creating new interplay among resources in Asia, the U.S., and Europe—even as the industry develops and sustains new technologies like HBM and heterogeneous integration. Geopolitical factors such as the CHIPS (Creating Helpful Incentives to Produce Semiconductors for America) Act, the scarcity of s... » read more

Managing Complexity And A Left Shift: Reconfigurable Mixed-Signal Circuits For Complex Integrated Systems


By Björn Zeugmann and Benjamin Prautsch The chip market is growing worldwide; it’s projected to nearly double by 2030 to over one trillion dollars. Most of this market is made up of digital functions in the form of logic, microprocessors, and memory. Although analog ICs account for only around 15% of the total, they are key components for overall systems and are therefore almost always pr... » read more

Thermal Challenges Multiply In Automotive, Embedded Devices


Embedding chips into stacked-die assemblies is creating thermal dissipation challenges that can reduce the reliability and lifespan of these devices, a growing problem as chipmakers begin cramming chiplets into advanced packages with thinner substrates between them. In the past, nearly all of these complex designs were used in tightly controlled environments, such as a large data center, whe... » read more

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