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Customer-Developed, Hyper-Convergent Design Flows Are Now Possible


We all know the days of sequential, compartmentalized chip design are over. In advanced technology nodes, placement impacts performance, performance impacts power, and routing impacts everything. The way to manage these challenges is to interleave design tasks. For example, provide information on late-stage routing to early-stage synthesis tools to improve convergence. This technique is commonl... » read more

DFT For SoCs Is Last, First, And Everywhere In Between


Back in the dawn of time, IC test was the last task in the design flow. First, you designed the chip and then you wrote the functional test program to verify it performed as expected after manufacturing. Without much effort, some portion of the functional test program was often reused as the manufacturing test to determine that the silicon was defect-free. Fast forward to today and things ha... » read more

Silo Busting In The Design Flow


An increasing number of dependencies in system design are forcing companies, people, tools, and flows to become more collaborative. Design and EDA companies must adapt to this new reality because it has become impossible for anyone to do it all by themselves. Moreover, what happens in manufacturing and packaging needs to be considered up front, and what gets designed in the design phase may ... » read more

Early And Fine Virtual Binning


Not all chips are created equal, and this is viewed as both a blessing and a curse by semiconductor makers. On one hand, chips can be screened for certain attributes, and some of the chips can be sold for higher prices than others. On the other hand, variations in the production process cause silicon performance to greatly differ, leaving chip makers with a wide and somewhat unpredictable distr... » read more

The Evolution Of Digital Twins


Digital twins are starting to make inroads earlier in the chip design flow, allowing design teams to develop more effective models. But they also are adding new challenges in maintaining those models throughout a chip's lifecycle. Until a couple of years ago, few people in the semiconductor industry had even heard the term "digital twin." Then, suddenly, it was everywhere, causing confusion ... » read more

Machine Learning Enabled Root Cause Analysis For Low Power Verification


By Himanshu Bhatt and Susantha Wijesekara Next-generation SoCs with advanced graphics, computing and artificial intelligence capabilities are posing unforeseen challenges in verification. Designers and verification engineers using static verification technologies for low power often see many violations in the initial stages. Efficient debugging and determining root cause is a real issue and ... » read more

Shift Left Verification With Comprehensive Lint Signoff


With soaring complexity and continuously increasing chip sizes, achieving efficient and predictable design closure has become a prominent challenge among designers today. Demand for a faster time to market is forcing designers to find ways to shorten design cycles with accurate, efficient, one-time RTL to silicon. To meet these requirements designers are looking to implement early ”shift left... » read more

Fusing Implementation And Verification


Susantha Wijesekara, senior application engineer at Synopsys, drills down into how to re-use Tcl scripts for static verification, what needs to be done with those scripts to make that possible, why that is critical to “shift left,” and how that approach saves time, money, and improves quality. » read more

Hybrid Prototyping


David Svensson, applications engineer in Synopsys’ Verification Group, explains how a virtual transaction logic model can be connected to develop hardware-dependent drivers before RTL actually exists, why this is now critical for large, complex designs, and how to find the potential bottlenecks and debug both software and hardware. » read more

Automotive Chip Design Workflow


Stewart Williams, senior technical marketing manager at Synopsys, talks about the consolidation of chips in a vehicle and the impact of 7/5nm on automotive SoC design, how to trade off power, performance, area and reliability, and how ISO 26262 impacts those variables. » read more

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