Software-Defined Hardware-Assisted Verification: Scaling To Quadrillions Of Cycles For Verification In The AI Era


The semiconductor industry is at an inflection point. The convergence of advanced multi-die architectures, AI-driven workloads, and rapidly evolving interface protocols is creating unprecedented design complexity. At the same time, market pressures demand faster time-to-market and higher performance, leaving little room for error. From data center to edge developments, users have to run softwar... » read more

Top Five Trends In RTL Signoff


By Suresh Babu Barla and Rimpy Chugh The “shift left” of the development cycle is critical for the huge, complex chips used in such applications as AI and high-performance computing (HPC). Identifying design issues at the netlist stage occurs far too late in the design development process. At this point, addressing such problems demands significant effort, primarily because most design-r... » read more

Unearthing Hidden Reliability Risks


Successful automotive electronic design requires a focus on safety, performance and customer satisfaction. This makes IC reliability not just a “nice to have” feature, but a fundamental requirement. From advanced driver-assistance systems (ADAS) to infotainment and powertrain controls, every IC must work with exceptional reliability, even in tough conditions. Imagine a tiny circuit flaw in ... » read more

Navigating Reliability Potholes: Early 3D Stress Analysis For Automotive ICs


The rise of 3D integrated circuits (ICs) and heterogeneous packaging is reshaping how automotive ICs fulfill demanding analog and sensor requirements. Whether for radar, lidar, sensor fusion or domain controllers, advanced packaging enables new levels of integration—and performance—in automotive electronics. Yet, as these architectures grow more complex, they also introduce new forms of mec... » read more

3D-ICs In The Automotive Market: Breaking Barriers With AI-Driven EDA Tools


The automotive industry is experiencing a significant transformation as it adopts innovations like autonomous driving technologies and ultra-connected ecosystems. At the core of this change is a rising demand for compact, high-performance semiconductor solutions that can handle the increasing complexity of modern vehicle architecture. One promising development is three-dimensional integrated ci... » read more

3D-IC Stress Analysis


The semiconductor industry is undergoing a transformation as 3D integrated circuits (ICs) and heterogeneous packaging become mainstream. With these advances comes the promise of higher functional density, a smaller footprint and enhanced system performance. However, these same innovations introduce new mechanical stressors within complex assemblies, posing novel reliability risks across the dev... » read more

Mastering Chiplet Design


The semiconductor industry is undergoing a fundamental shift from monolithic chip designs to chiplet-based architectures. This modular approach promises enhanced performance, cost efficiency, and scalability, but it also brings unique system-level verification challenges that design teams must overcome. Chiplet systems break different functions into smaller, separate dies, improving yield an... » read more

Shifting Left With DFT To Optimize Productivity, Testability, And Time-To-Market


This paper discusses one of the Siemens EDA shift-left strategies in the RTL-to-signoff flow: shift-left design-for-test (DFT). Tessent RTL Pro software automates the analysis and insertion of Tessent VersaPoint test point technology, LBIST-OST test points, dedicated scan wrapper cells and x-bounding logic as behavioral code at the RTL level. Tessent RTL Pro builds on Tessent’s market-leading... » read more

Reap Rewards With Shift-Left Pattern Matching For Custom And AMS Designs


To keep up with the growing complexities of IC design, major semiconductor companies are adopting shift-left strategies. For verification, this means pulling much of the work into the physical design stage. By moving critical checks earlier in the design cycle, you can identify and resolve issues before they escalate, streamlining the overall development process. The Calibre tools have been ... » read more

Shift Left In DFT Design


The semiconductor industry continues to face numerous challenges as designs approach reticle limits, process nodes evolve and engineering resources become increasingly stretched. It is essential to maintain high productivity and quality throughout the design flow. This keeps projects on schedule, within budget, and ensures they remain high-quality, reliable, yield well and perform as intended. ... » read more

← Older posts Newer posts →