Reduce Power, Area And Routing Congestion

Analysis of a high-performance on-chip bus interconnect.

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This paper, using an example design, demonstrates how to meet challenging performance, latency and bandwidth goals by using the DesignWare Interconnect Fabric for the ARM® AMBA 3 AXI while minimizing the total area, power consumption and number of top-level wires. The paper also studies the design requirements and examines the optimization features of the DesignWare Interconnect Fabric used to meet the stringent timing requirements.

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