Non-Volatile Memory Tradeoffs Intensify


Non-volatile memory is becoming more complicated at advanced nodes, where price, speed, power and utilization are feeding into some very application-specific tradeoffs about where to place that memory. NVM can be embedded into a chip, or it can be moved off chip with various types of interconnect technology. But that decision is more complicated than it might first appear. It depends on the ... » read more

Transient Thermal Analysis For M.2 SSD Thermal Throttling: Detailed CFD Model vs Network-Based Model


Solid State Drive (SSD) technology continues to advance toward smaller footprints with higher bandwidth and adoption of new I/O interfaces in the PC market segment. Power performance requirements are tightening in the design process to address specific requirement along with the development of SSD technology. To meet this aggressive requirement of performance, one major issue is thermal throttl... » read more

Machine Learning At The Edge


Moving machine learning to the edge has critical requirements on power and performance. Using off-the-shelf solutions is not practical. CPUs are too slow, GPUs/TPUs are expensive and consume too much power, and even generic machine learning accelerators can be overbuilt and are not optimal for power. In this paper, learn about creating new power/memory efficient hardware architectures to meet n... » read more

GDDR6 Drilldown: Applications, Tradeoffs And Specs


Frank Ferro, senior director of product marketing for IP cores at Rambus, drills down on tradeoffs in choosing different DRAM versions, where GDDR6 fits into designs versus other types of DRAM, and how different memories are used in different vertical markets. » read more

RISC-V Challenges And Opportunities


Semiconductor Engineering sat down to discuss open instruction set hardware and the future of RISC-V with Ben Levine, senior director of product management in Rambus' Security Division; Jerry Ardizzone, vice president of worldwide sales at Codasip; Megan Wachs, vice president of engineering at SiFive; and Rishiyur Nikhil, CTO of Bluespec. What follows are excerpts of that conversation. (L-... » read more

Making Sense Of ML Metrics


Steve Roddy, vice president of products for Arm’s Machine Learning Group, talks with Semiconductor Engineering about what different metrics actually mean, and why they can vary by individual applications and use cases. » read more

Focus Shifts To Wasted Power


Mobile phones made the industry aware of power, but now the focus is shifting to the total energy needed to perform a task. Activity that is unnecessary to perform the intended task is wasted power, and reducing it requires some new methodologies and structural changes within development teams. There is a broadening awareness about power. "The companies doing SoCs for mobile lead the charge ... » read more

Less Margin, More Respins, And New Markets


Semiconductor Engineering sat down to discuss the impact of multi-physics and new market applications on chip design with John Lee, general manager and vice president of ANSYS' Semiconductor Business Unit; Simon Burke, distinguished engineer at Xilinx; Duane Boning, professor of electrical engineering and computer science at MIT; and Thomas Harms, director EDA/IP Alliance at Infineon. What foll... » read more

New Challenges In Testing 5G Devices


Alejandro Buritica, senior solutions marketing manager at National Instruments, talks about what will be needed for mass-market testing of 5G devices, how to focus signals to overcome signal attenuation, and how to make over-the-air testing viable where leads are not exposed. » read more

The Great Data Flood Ahead


The number of devices connected to the Internet is expected to exceed 1 trillion devices over the next decade or so. The timeline is a bit fuzzy, in part because no one is actually counting all of these devices, but the implications are pretty clear. A data deluge of biblical proportions is headed our way, and so far no one has any idea of what to do with all of it. From a system-level s... » read more

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