Heat-Related Issues Impact Reliability In Advanced IC Designs

Heat is becoming a much bigger problem in advanced-node chips and packages, causing critical electrons to leak out of DRAM, timing and reliability issues in 3D-ICs, and accelerated aging that are unique to different workloads. All types of circuitry are vulnerable to thermal effects. It can slow the movement of the electrons through wires, cause electromigration that shortens the lifespan of... » read more

Intel Vs. Samsung Vs. TSMC

The three leading-edge foundries — Intel, Samsung, and TSMC — have started filling in some key pieces in their roadmaps, adding aggressive delivery dates for future generations of chip technology and setting the stage for significant improvements in performance with faster delivery time for custom designs. Unlike in the past, when a single industry roadmap dictated how to get to the next... » read more

Power/Performance Costs In Chip Security

Hackers ranging from hobbyists to corporate spies and nation states are continually poking and prodding for weaknesses in data centers, cars, personal computers, and every other electronic device, resulting in a growing effort to build security into chips and electronic systems. The current estimate is that 60% of chips and systems have some type of security built in, and that percentage is ... » read more

Placement And CTS Techniques For High-Performance Computing Designs

This paper discusses the challenges of designing high-performance computing (HPC) integrated circuits (ICs) to achieve maximum performance. The design process for HPC ICs has become more complex with each new process technology, requiring new architectures and transistors. We highlight how the Siemens Aprisa digital implementation solution can solve placement and clock tree challenges in HPC de... » read more

Optimizing IC Designs For Real-World Use Cases

Semiconductor systems are becoming more focused on power, performance, and area for the primary scenarios they are likely to see in real-world applications, but increasingly at the expense of secondary tasks. This is happening at all levels of abstraction and all stages of the design flow. At the highest level, processors are being optimized to run a given set of software. RISC-V is one of t... » read more

Battling Over Shrinking Physical Margin In Chips

Smaller process nodes, coupled with a continual quest to add more features into designs, are forcing chipmakers and systems companies to choose which design and manufacturing groups have access to a shrinking pool of technology margin. In the past margin largely was split between the foundries, which imposed highly restrictive design rules (RDRs) to compensate for uncertainties in new proces... » read more

Getting Rid Of Heat In Chips

Power consumed by semiconductors creates heat, which must be removed from the device, but how to do this efficiently is a growing challenge. Heat is the waste product of semiconductors. It is produced when power is dissipated in devices and along wires. Power is consumed when devices switch, meaning that it is dependent upon activity, and that power is constantly being wasted by imperfect de... » read more

Power/Performance Costs Of Securing Systems

For much of the chip industry, concerns about security are relatively new, but the requirement for protecting semiconductor devices is becoming pervasive. Unfortunately for many industries, that lesson has been learned the hard way. Security breaches have led to the loss of sensitive data, ransomware attacks that lock up data, theft of intellectual property or financial resources, and loss o... » read more

A Highly Wasteful Industry

The systems industry as a whole is not concerned about power. I know that is a bold statement, but I believe it to be true. The semiconductor industry is mildly concerned, but only indirectly. They care about power because thermal issues are limiting the functionality they can squeeze onto a chip, or in a package. Some users, such as data center operators, claim to care about power because i... » read more

Holistic Power Reduction

The power consumption of a device is influenced by every stage of the design, development, and implementation process, but identifying opportunities to save power no longer can be just about making hardware more efficient. Tools and methodologies are in place for most of the power-saving opportunities, from RTL down through implementation, and portions of the semiconductor industry already a... » read more

← Older posts