Gaps Emerging In System Integration


The system integration challenge is evolving, but existing tools and methods are not keeping up with the task. New tools and flows are needed to handle global concepts, such as power and thermal, that cannot be dealt with at the block level. As we potentially move into a new era where IP gets delivered as physical pieces of silicon, this lack of an accepted flow will become a stumbling block. ... » read more

Lower Resistance Protects Against Failure In IC Design


By Fady Fouad, Esraa Swillam, and Jeff Wilson When you’re fighting off a threat, you typically want all the resistance you can muster. In IC design, on the other hand, minimizing resistance is crucial to success in power structure design. As metals get narrower with technology node advances, resistance levels rise, and voltage drop (IR) and electromigration (EM) issues grow, both in number... » read more

The Other Storage Race


Tesla's push to extend the life of lithium ion batteries used in cars by repurposing them for less-intensive applications could have a major impact on the business model for a whole slew of other markets. As anyone with a smartphone knows, batteries degrade over time. A new phone holds a charge longer than one that has been in use for several years, but in the case of a smartphone that's gen... » read more

Meeting The Power Challenges of ADAS


Advanced driver assistance systems (ADAS) technologies have the potential to improve driver safety and comfort, and to reduce car accidents and casualties. The adoption of ADAS technologies creates challenges in electronic solutions size, safety, and reliability. This white paper reviews the challenges for ADAS electronic components of a smart car and presents a few examples of how power man... » read more

Power Management And Integration Of IPs In SoCs: Part 1


IPs – whether in the form of soft or hard macros – are the epicenter of today’s SoC designs. Integration of IP with low power designs and conducting power aware (PA) verification are always complex and cumbersome. Because most of these IPs are self-contained, pre-verified at the block level, and must be preserved in their totality when integrated or verified at the SoC level. Until UPF... » read more

HBM Issues In AI Systems


All systems face limitations, and as one limitation is removed, another is revealed that had remained hidden. It is highly likely that this game of Whac-A-Mole will play out in AI systems that employ high-bandwidth memory (HBM). Most systems are limited by memory bandwidth. Compute systems in general have maintained an increase in memory interface performance that barely matches the gains in... » read more

Understanding SLAM (Simultaneous Localization And Mapping)


Amol Borkar, senior product manager for AI and computer vision at Cadence, talks with Semiconductor Engineering about mapping and tracking the movement of an object in a scene, how to identify key corners in a frame, how probabilities of accuracy fit into the picture, how noise can affect that, and how to improve the performance and reduce power in these systems. » read more

Tradeoffs In Embedded Vision SoCs


Gordon Cooper, product marketing manager for embedded vision processors at Synopsys, talks with Semiconductor Engineering about the need for more performance in these devices, how that impacts power, and what can be done to optimize both prior to manufacturing. » read more

Non-Volatile Memory Tradeoffs Intensify


Non-volatile memory is becoming more complicated at advanced nodes, where price, speed, power and utilization are feeding into some very application-specific tradeoffs about where to place that memory. NVM can be embedded into a chip, or it can be moved off chip with various types of interconnect technology. But that decision is more complicated than it might first appear. It depends on the ... » read more

Transient Thermal Analysis For M.2 SSD Thermal Throttling: Detailed CFD Model vs Network-Based Model


Solid State Drive (SSD) technology continues to advance toward smaller footprints with higher bandwidth and adoption of new I/O interfaces in the PC market segment. Power performance requirements are tightening in the design process to address specific requirement along with the development of SSD technology. To meet this aggressive requirement of performance, one major issue is thermal throttl... » read more

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