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Residual Stress With EIGER2 R 500K

X-ray diffraction detects changes in atomic spacing from strained materials.

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Many manufacturing processes leave residual stresses which can affect the performance of manufactured components. Compressive stress can be engineered into a metal coating to resist crack propagation, while tensile stress can be exploited to enhance conductivity in semiconductors. Strained materials exhibit changes in atomic spacing which can be detected by X-ray diffraction (XRD) and related to the stress via elastic constants.

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