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Review of Advances in 3D integration of 2D Neuromorphic Electronics, Materials to Systems

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A new technical paper titled “2D materials-based 3D integration for neuromorphic hardware” was published by researchers at  Seoul National University and University of Southern California.

Find the technical paper here. November 2024.

Kim, S.J., Lee, HJ., Lee, CH. et al. 2D materials-based 3D integration for neuromorphic hardware. npj 2D Mater Appl 8, 70 (2024). https://doi.org/10.1038/s41699-024-00509-1. Creative Commons.



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