An emerging method of working that will make product development and deployment more deterministic.
Semiconductors have always been challenging to develop, with many waves of innovation in electronic design automation (EDA) tools and fabrication technologies barely keeping ahead of ever-growing design size and sophistication. Once again, the industry has reached a tipping point. The combination of increasing chip and system complexity, coupled with higher expectations for product performance and longevity, has defined new boundary limitations in designing, manufacturing and deploying semiconductors. Incremental improvements to traditional methods will not be enough to move forward; a new approach is required.
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100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Increased transistor density and utilization are creating memory performance issues.
Lots of unknowns will persist for decades across multiple market segments.
FPGAs, CPUs, and equipment receive funding in China; 98 startups raise over $2 billion.
Suppliers are investing new 300mm capacity, but it’s probably not enough. And despite burgeoning 200mm demand, only Okmetic and new players in China are adding capacity.
100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
From low resistance vias to buried power rails, it takes multiple strategies to usher in 2nm chips.
Some of the less common considerations for assessing the suitability of a system for high-performance workloads.
Manufacturing 3D structures will require atomic-level control of what’s removed and what stays on a wafer.
Different interconnect standards and packaging options being readied for mass chiplet adoption.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Disaggregation and the wind-down of Moore’s Law have changed everything.
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