The integration of optical components on a chip creates a host of new challenges and demands for wafer-level probing of SiPh devices.
As chip designers are pressed for ever-increasing data rates, the use of wavelength-division multiplexing (WDM) with infrared photonic signals as a data transfer medium is increasingly finding its way into CMOS silicon-based devices. Termed “silicon photonics” (SiPh), this technology is not only being used to displace traditional electrical interconnects, but also for a broad range of applications, including lidar, quantum computing, and biosensing.
The integration of optical components on a chip creates a host of new challenges and demands for wafer-level probing of SiPh devices, where huge volumes of device-performance data are required to carry a design from concept to qualification and into production.
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