Simulations à la Carte: Infusing SPICE Models For A Tasty Design Experience

Have you ever noticed how the simplest dishes become unforgettable with just the right seasoning? As an Ecuadorian, I’ve learned this firsthand. A touch of “ají”—a traditional chili sauce—can transform any meal into something extraordinary. The tamarillo-based hot sauce is my personal favorite. It’s not just a condiment; it’s an experience. And when it comes to power electronics, I’ve come to see SPICE models in the same way. They’re the secret ingredient that can take your circuit simulations from bland to brilliant.

Let me show you how adding a bit of SPICE to your simulations can make all the difference.

The foundation for a flavorful design: Compact models

Think of a compact model as your base recipe. It’s the essential framework that captures the behavior of a semiconductor device. As shown in figure 1, a good compact model blends all the critical elements: electrical characteristics, parasitic effects, and even thermal dynamics [1].

For example, a compact model typically includes three layers:

• Chip model: The core of the device, accounting for its on-state and off-state characteristics, capacitances, and thermal behavior.
• Parasitic model: This layer considers resistive, inductive, and capacitive effects from the package—factors that can influence performance.
• Thermal model: It simulates how heat flows through the device, giving you insight into self-heating effects during operation.

Fig. 1: A simplified structure of a compact model is shown for a SiC MOSFET in a TO247-4 package.

When these models come together, they provide a detailed picture of how a semiconductor behaves in real-world conditions. But, as with any recipe, the quality of the outcome depends on the precision and care put into each ingredient.

In the land of flavors, spicy is the king: SPICE models

In the world of circuit simulations, SPICE models are the trusted seasoning. They’re incredibly detailed and flexible, making them perfect for analyzing switching behavior under various conditions. But just like too much chili in a dish, there’s a tradeoff: SPICE simulations can be time-consuming, especially for long-term scenarios, like a solar inverter operating over a full day.

To speed things up, designers sometimes use simplified thermal-loss models based on datasheet data. These are faster to work with but come with limitations. They often represent how a device performs on a specific test bench rather than in real-life applications, which can lead to less accurate results. A brief comparison between both abstraction levels is depicted in figure 2.

Fig. 2: Comparison of SPICE model and thermal-loss description models.

It’s a bit like cooking with pre-made sauces—quick and convenient, but not quite as satisfying as making everything from scratch.

When life gives you chilies, make it hot

So, how do you get the best of both worlds? How do you achieve simulations that are both fast and accurate? At Infineon, we asked these same questions, and we’ve worked hard to deliver the answers.

Our SPICE SiC MOSFET models are like your fresh, high-quality ingredients. Designed for accuracy, they provide detailed insights into dynamic response and performance. And here’s the best part: we’ve built an automated workflow that takes these models to the next level.

Using our SPICE simulator [2], we’ve created a system that extracts switching waveforms under various conditions, calculates energy losses, and translates them into a thermal-loss format (XML files). A simplified flow scheme is shown in figure 3. This makes it easy to incorporate high-quality data into system-level simulations without sacrificing speed. Imagine having a perfectly balanced sauce ready to enhance any dish—that’s what we’re offering for your circuit designs.

Fig. 3: Flow diagram to design custom thermal models using SPICE simulations.

The finishing touch

Like a great meal, a successful power converter design is all about balance. You need the right ingredients, careful preparation, and attention to detail. At Infineon, we’re passionate about helping you get it just right.

With our SPICE models and simulation tools, you’ll gain deeper insights into how our products perform in your specific applications. You’ll save time, reduce costs, and open the door to faster innovations—all while improving system performance and reliability. And let’s not forget the big win: a reduced carbon footprint, thanks to more efficient designs.

So, the next time you’re working on a simulation, remember this: a little SPICE can go a long way. Explore our tools [3], try our models, and see how they can transform your designs. After all, every great creation—whether it’s a dish or a circuit—deserves the perfect touch.

References

1. P. Sochor, A. Huerner, Q. Sun and R. Elpelt, “Characteristics of SiC MOSFET Compact Models Suitable for Virtual Prototyping of Power Electronic Circuits,” 2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 – ECCE Asia), Jeju Island, Korea, Republic of, 2023, pp. 112-119, doi: 10.23919/ICPE2023-ECCEAsia54778.2023.10213920.
2. https://www.infineon.com/cms/de/design-support/simulation-modeling/infineonspice-offline-simulation-tool/?redirId=291697
3. https://iposim.infineon.com/