Typical functions for analytics and 3D surround view in auto-valet parking system with data-flow and its mapping to multiple cores of TDA4VMID SoC.
Abstract
“Auto-Valet parking is a key emerging function for Advanced Driver Assistance Systems (ADAS) enhancing traditional surround view system providing more autonomy during parking scenario. Auto-Valet parking system is typically built using multiple HW components e.g. ISP, micro-controllers, FPGAs, GPU, Ethernet/PCIe switch etc. Texas Instrument’s new Jacinto7 platform is one of industry’s highest integrated SoC replacing these components with a single TDA4VMID chip. The TDA4VMID SoC can concurrently do analytics (traditional computer vision as well as deep learning) and sophisticated 3D surround view, making it a cost effective and power optimized solution. TDA4VMID is a truly heterogeneous architecture and it can be programmed using an efficient and easy to use OpenVX based middle-ware framework to realize distribution of software components across cores. This paper explains typical functions for analytics and 3D surround view in auto-valet parking system with data-flow and its mapping to multiple cores of TDA4VMID SoC. Auto-valet parking system can be realized on TDA4VMID SOC with complete processing offloaded of host ARM to the rest of SoC cores, providing ample headroom for customers for future proofing as well as ability to add customer specific differentiation.”
Find the technical paper link here.
Authors: Mody, Mihir; Chitnis, Kedar; Hariyani, Hemant; Jagannathan, Shyam; Jones, Jason; Shurtz, Gregory; Shankar, Abhishek; Ankur; Mangla, Mayank; Govindarajan, Sriramakrishnan; Dubey, Aish; Chirca, Kai
Some segments are normalizing, others may be impacted through 2022.
Massive expansion campaign targets wide variety of chips, but export controls limit growth at leading edge.
Why cyberattacks on the IC supply chain are so hard to prevent.
How dopant atoms could make qubits that last much longer.
Sharing resources can significantly improve utilization and lower costs, but it’s not a simple shift.
As SiC moves to higher voltages, BEV users get faster charging, extended range, and lower system costs
Imec’s SVP drills down into GAA FETs, interconnects, chiplets, and 3D packaging.
Five process nodes in four years, high-NA EUV, 3D-ICs, chiplets, hybrid bonding, and more.
Some segments are normalizing, others may be impacted through 2022.
Abstraction is the key to custom processor design and verification, but defining the right language and tool flow is a work in progress.
Some things will get better from a design perspective, while others will be worse.
Massive expansion campaign targets wide variety of chips, but export controls limit growth at leading edge.
Processing data in place can cut down on a lot of data movement, but the technology wasn’t there — until now.
Leave a Reply