Here Comes High-Res Car Radar


A dozen or so startups are developing high-resolution radar chips that use various modulation schemes and processes, such as CMOS, FD-SOI and even metamaterials. In theory, high-resolution radar could boost the capabilities of today’s radar for cars, as well as eliminate the need for a separate LiDAR system. But the technology is still in the research stage and has yet to be proven commerc... » read more

ADAS Design Shifts Toward Hardware


Autonomous driving will challenge system-level designers like never before with the simultaneous integration of three critical areas: Supercomputing complexity, real-time embedded performance, and functional safety. To get there, developers will need to shift their focus from a software-centric approach toward custom hardware development to produce a system that meets the safety, cost, and powe... » read more

Advanced Packaging’s Progress


Shim Il Kwon, CTO at STATS ChipPAC, sat down with Semiconductor Engineering to discuss the current and future trends of chip packaging. What follows are excerpts of that conversation. SE: The outsourced semiconductor assembly and test (OSAT) vendors provide third-party IC-packaging and test services. What are the big challenges for OSATs today? Shim: The OSAT market is very competitive, w... » read more

Functional Safety Issues Rising


Developing semiconductors for safety-critical markets such as automotive, industrial and medical involves a growing list of extra steps that need to be taken pre- and post-manufacturing to ensure product integrity, reliability and security. This is causing several significant changes: • Designs are becoming much more complicated because they require such features as failover and redundan... » read more

Expanding Ecosystem Drives Automotive Semiconductor Gold Rush


Semiconductor chips designed to support automotive applications have been around for more than 40 years, a very long time in the technology business. These chips have been developed by semiconductor integrated device manufacturers (IDMs), who control every step of the design, manufacturing, test, qualification, reliability and quality aspects of these automotive chips. On top of that, special s... » read more

How To Make Autonomous Vehicles Reliable


The number of unknowns in automotive chips, subsystems and entire vehicles is growing as higher levels of driver assistance are deployed, sparking new concerns and approaches about how to improve reliability of these systems. Advanced Driver Assistance Systems (ADAS) will need to detect objects, animals and people, and they will be used for parking assistance, night vision and collision avoi... » read more

Executive Insight: Lip-Bu Tan


Semiconductor Engineering sat down with Lip-Bu Tan, president and CEO of [getentity id="22032" e_name="Cadence"], to discuss disruptions and changes in the semiconductor industry, from machine learning and advance packaging to tools and business. What follows are excerpts of that conversation. SE: What do you see as the next big thing? Tan: Unlike mobility or cell phones, or PCs before th... » read more

The 200mm Equipment Scramble


An explosion in 200mm demand has set off a frenzied search for used semiconductor manufacturing equipment that can be used at older process nodes. The problem is there is not enough used equipment available, and not all of the new or expanding 200mm fabs can afford to pay the premium for refurbished or new equipment. This may sound like a straightforward supply and demand issue, but behind t... » read more

What Is Spin Torque MRAM?


The memory market is going in several different directions at once. On one front, the traditional memory types, such as DRAM and flash, remain the workhorse technologies. Then, several vendors are readying the next-generation memory types. As part of an ongoing series, Semiconductor Engineering will explore where the new and traditional memory technologies are heading. For this segment, P... » read more

How Reliable Are FinFETs?


Stringent safety requirements in the automotive and industrial sectors are forcing chipmakers to re-examine a number of factors that can impact reliability over the lifespan of a device. Many of these concerns are not new. Electrical overstress (EOS), electrostatic discharge (ESD) and [getkc id="160" kc_name="electromigration"] (EM) are well understood, and have been addressed by EDA tools f... » read more

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