Panel Fan-out Ramps, Challenges Remain


After years of R&D, panel-level fan-out packaging is finally beginning to ramp up in the market, at least in limited volumes for a few vendors. However, panel-level fan-out, which is an advanced form of today’s fan-out packaging, still faces several technical and cost challenges to bring this technology into the mainstream or high-volume manufacturing. Moreover, several companies are d... » read more

Ethernet TSN for Automotive ADAS Applications


The new age of automotive electronic systems has decreased accidents and fatalities. Improving Advanced Driver Assistance Systems (ADAS) for safety-critical automotive applications is the next wave and requires a huge amount of data transmission and subsequent processing. Systems are becoming more sophisticated as they combine ADAS applications from emergency braking, collision avoidance, lane ... » read more

Security for MEMS, Sensors


Napa, Calif. — The role of MEMS and sensors is growing as more devices are connected and more intelligence is added into those devices. But that has created its own set of issues involving security and privacy. “Our strategic landscape is changing,” observed Cynthia Wright, principal cybersecurity engineer at The MITRE Corp. and CEO of Synthus, during a keynote speech on day one of the... » read more

ADAS Further Extends 7nm Challenges


As we discussed previously on the LPHP blog, 7nm nodes hold great promise for reducing power, improving performance and increasing density for next-generation chips, but also present a set of engineering challenges. When you factor in the standards set for autonomous vehicles (AV) and advanced driver assistance systems (ADAS) system-on-chips or SoCs, those challenges can more than double. Autom... » read more

ADAS Meets Anthropology


Melissa Cefkin, principal scientist and design anthropologist at the Nissan Research Center, sat down with Semiconductor Engineering to talk about how people will interact with autonomous vehicles and AI and why different disciplines are required to make this work. What follows are excerpts of that conversation. SE: Why did Nissan hire an anthropologist? Cefkin: Anthropologists have been ... » read more

Automakers Take On More Responsibility


Chip and EDA companies are scrambling to deal with stiff safety regulations and harsh environmental conditions for automotive chips, but automakers are making big changes of their own to ensure all those components work together as expected. The result is a significant shift of responsibilities of companies in the automotive supply chain. Carmakers traditionally have left verification, valid... » read more

Adding Safety Into Automotive Design


The ISO 26262 spec is a household term for anyone even remotely involved with the automotive industry today. Increasingly, though, it is being used interchangeably with safety-readiness across the entire supply chain. ISO 26262 compliance is a prerequisite for IP and chips used in an increasing number of automotive applications. It applies to systems, software, and to individual products. An... » read more

Data Converters For Automotive Applications


Sensor applications requiring data converters range from temperature sensors identifying different engine status to radar/LIDAR enabling Automotive Driver Assistance Systems (ADAS). Other applications involving data converters include wireless transceivers for communicating with other vehicles or with a fixed network. The data converter IP (analog-to-digital and digital-to-analog) provides an i... » read more

Giving Cars A Bird’s-Eye View


Will the world be a better place in which to live by having autonomous cars driving around us? Or would it be unsafe and scary? Maybe someone was asking such a question even when the first steam-powered automobile capable of human transportation was built in 1769 [1]! As a person who likes driving, I wouldn’t like to have a ‘fully’ autonomous car, but I would like to get some assistanc... » read more

Variation’s Long, Twisty Tail Worsens At 7/5nm


Variation is becoming a bigger challenge at each new node, but not just for obvious reasons and not always from the usual sources. Nevertheless, dealing with these issues takes additional time and resources, and it can affect the performance and reliability of those chips throughout their lifetimes. At a high level, variation historically was viewed as a mismatch between what design teams in... » read more

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