Power, Reliability And Security In Packaging


Semiconductor Engineering sat down to discuss advanced packaging with Ajay Lalwani, vice president of global manufacturing operations at eSilicon; Vic Kulkarni, vice president and chief strategist in the office of the CTO at ANSYS; Calvin Cheung, vice president of engineering at ASE; Walter Ng, vice president of business management at UMC; and Tien Shiah, senior manager for memory at Samsun... » read more

Week in Review: IoT, Security, Auto


Products/Services Mentor, a Siemens Business, announced the release of the final phase of the Valor software New Product Introduction design-for-manufacturing technology, automating printed circuit board design reviews. The company has integrated DFM technology into the Xpedition software layout application. Arteris IP reports that Toshiba has taped out its next-generation advanced driv... » read more

Week in Review: IoT, Security, Auto


Products/Services Achronix Semiconductor selected the Rambus GDDR6 PHY for its next-generation Speedster7t line of field-programmable gate arrays. The Rambus GDDR6 PHY is used in advanced driver-assistance systems, artificial intelligence, graphics, machine learning, and networking applications. Arm and Marvell Technology Group will work together on design and development of Marvell’s nex... » read more

Week in Review: IoT, Security, Auto


Internet of Things Verizon Communications launched its nationwide narrowband Internet of Things network, saying it covers more than 92% of the U.S. population. “There is a whole universe of smart solutions needing scalable and affordable connections,” Jeffrey Dietel, senior vice president of business marketing and products, said in a statement. “By launching our NB-IoT network, Verizon i... » read more

Is ADAS The Edge?


Debate is brewing over whether ADAS applications fall on the edge, or if they are better viewed squarely within the context of the automotive camp. There is more to this discussion than just semantics. The edge represents a huge greenfield opportunity for electronics of all sorts, and companies from the mobile market and from the cloud are both rushing to stake their claim. At this point the... » read more

Road Not Fully Constructed


There is a growing consensus in the semiconductor industry that SAE Level 3 and Level 4 autonomy will be full of unexpected hazards. At a number of recent conferences in Silicon Valley, experts from all parts of the semiconductor industry have voiced concern about those middle steps between assisted driving and full autonomy. This isn't the public position taken by carmakers and Tier 1s.... » read more

Uhnder: Digital Radar Chips


Radar used to be slow, clunky, and expensive. That's changing quickly as tech companies begin bringing single-chip or single-package solutions to market, setting the stage for a price/performance battle in markets ranging from automotive to robotics. Uhnder, an Austin, Texas-based startup, is the first to roll out a single-chip radar solution that it claims is roughly 100X less expensive tha... » read more

Electric Cars Gain Traction, But Challenges Remain


Battery-powered electric vehicles are expected to reach a milestone in terms of shipments in 2019, but the technology faces several significant hurdles to gain wider adoption in the market. Limited driving range, high costs, battery issues, and a spotty charging infrastructure are the main challenges for battery electric vehicles (BEVs). In addition, there are issues with various power semic... » read more

Moore’s Law Now Requires Advanced Packaging


Semiconductor Engineering sat down to discuss advanced packaging with Calvin Cheung, vice president of engineering at ASE; Walter Ng, vice president of business management at UMC; Ajay Lalwani, vice president of global manufacturing operations at eSilicon; Vic Kulkarni, vice president and chief strategist in the office of the CTO at ANSYS; and Tien Shiah, senior manager for memory at Samsung. W... » read more

The Long And Detailed Road To Automotive Compliance


Compliance with automotive safety requirements is slowing down both innovation and participation by a flurry of startups as the whole ecosystem struggles to bring autonomous vehicles to reality. This is particularly onerous for chipmakers, which face a high bar for IC integrity and reliability. They must meet specifications and be free of design errors. Improper behavior in corner-case s... » read more

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