Why rotational scanning shrinks inspection time in complex chips and packages.
Higher density and more vertical layers require higher-resolution inspection. In the past that generally resulted in longer scan times, which can slow throughput in the fab or assembly house. Bryan Schackmuth, senior product line manager at Nordson Test & Inspection, explains how rotational scanning using acoustic wafer inspection can speed up inspection time by a factor of eight, why it is so effective at spotting delamination and cracks, and how it can save additional time by focusing more scan time on the edge of the wafer than at the center.
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