Better Analytics Needed For Assembly


Package equipment sensors, newer inspection techniques, and analytics enable quality and yield improvement, but all of those will require a bigger investment on the part of assembly houses. That's easier said than done. Assembly operations long have operated on thin profit margins because their tasks were considered easy to manage. Much has changed over the past several years, however. The r... » read more

Finding Defects In IC Packages


Several equipment makers are ramping up new inspection equipment to address the growing defect challenges in IC packaging. At one time, finding defects in packaging was relatively straightforward. But as packaging becomes more complex, and as it is used in markets where reliability is critical, finding defects is both more difficult and more important. This has prompted the development of a ... » read more

X-ray Detects Hidden Failure Modes


Functional testing and visual examination using stereo microscopy are today's 'standard' quality control techniques for characterising yield and workmanship-related issues in IC fabrication and electronics assembly. Currently used test methodologies—such as IPC-TM-650—rely heavily on visual examination. The visual detection of defects can still be difficult, as samples need to be inspected ... » read more

X-Ray Reveals Wire Bonding And Field Failures


Wire bonding is widely used for first-level interconnection of semiconductor die to component leads or pads. It is vital that the interconnection corresponds to the product-specific bonding diagram and that the wire bonding is of an acceptable robustness and quality. X-ray technology is critical for ensuring both. To read more, click here. » read more