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Surviving The Three Phases Of High Density Advanced Packaging Design

Why process changes are needed for FOWLP, CoWoS, and WOW.

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The growth of High Density Advanced Packages (HDAP) such as FOWLP, CoWoS, and WoW is triggering a convergence of the traditional IC design and IC package-design worlds. To handle these various substrate scenarios, process transformation must occur. This paper discusses the three phases of HDAP design and provides tips on how to survive their challenges.

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