Systems & Design

Surviving The Three Phases Of High Density Advanced Packaging Design

Why process changes are needed for FOWLP, CoWoS, and WOW.


The growth of High Density Advanced Packages (HDAP) such as FOWLP, CoWoS, and WoW is triggering a convergence of the traditional IC design and IC package-design worlds. To handle these various substrate scenarios, process transformation must occur. This paper discusses the three phases of HDAP design and provides tips on how to survive their challenges.

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