Five Trends In IC Packaging


At one time, chip packaging was an afterthought. Chipmakers were more worried about IC design. Packaging was considered a mere commodity, which was simply used to house the design. More recently, though, chip packaging has become a hot topic. The IC design is still important, but packaging is a key part of the solution. In fact, the industry can go down two paths. The traditional way is t... » read more

Litho Options For Panel Fan-out


Several packaging houses are inching closer to production of panel-level fan-out packaging, a next-generation technology that promises to reduce the cost of today’s fan-out packages. In fact, ASE, Nepes, Samsung and others already have installed the equipment in their panel-level fan-out lines with production slated for 2018 or so. But behind the scenes, panel-level packaging houses contin... » read more

Re-Using IP In Packaging


For the past decade, the promise held forth by advanced packaging was that it would allow chipmakers to mix and match analog and digital IP without worrying about the process node at which they were developed or the physical interactions between components. This is a big deal when it comes to analog. Analog IP doesn't benefit from node shrinking the way digital logic does, and in many cases ... » read more

What’s Next In Scaling, Stacking


An Steegen, executive vice president of semiconductor technology and systems at [getentity id="22217" e_name="Imec"], sat down with Semiconductor Engineering to discuss IC scaling, chip stacking, packaging and other topics. Imec is an R&D organization in Belgium. What follows are excerpts of that conversation. SE: Chipmakers are shipping 16nm/14nm processes with 10nm and 7nm technologies... » read more

Reworking Established Nodes


New technology markets and a flattening in smartphone growth has sparked a resurgence in older technology processes. For many of these up-and-coming applications, there is no compelling reason to migrate to the latest process node, and equipment companies and fabs are rushing to fill the void. As with all electronic devices, the focus is on cost-cutting. But because these markets are likely ... » read more

2.5D, Fan-Out Inspection Issues Grow


As advanced packaging moves into the mainstream, packaging houses and equipment makers are ratcheting up efforts to solve persistent metrology and inspection issues. The goal is to lower the cost of fan-outs, [getkc id="82" kc_name="2.5D"] and [getkc id="42" kc_name="3D-IC"], along with a number of other packaging variants consistent with the kinds of gains that are normally associated with Moo... » read more

Advanced Packaging Goes Mainstream


The roadmap for shrinking digital logic will continue for at least the next 10 years. For others devices, particularly analog, it will slow down or end. And therein lies one of the most fundamental changes in semiconductor design and manufacturing in the past half century. This is no longer just talk. Apple is using a fan-out architecture in its iPhone 7. Memory makers are stacking NAND and ... » read more

Wirebond Technology Rolls On


Several years ago, many predicted the demise of an older interconnect packaging technology called wire bonding, prompting the need for more advanced packaging types. Those predictions were wrong. The semiconductor industry today uses several advanced packaging types, but wire bonding has been reinvented over the years and remains the workhorse in packaging. For example, Advanced Semiconducto... » read more

OSAT Biz: Growth And Challenges


Amid a challenging business environment, the outsourced semiconductor assembly and test (OSAT) industry is projected to see steady to strong growth in a number of packaging segments this year. Right now, the [getkc id="83" kc_name="OSATs"]—which provide third-party IC-packaging and test services—are seeing brisk demand for both legacy and advanced chip packages. In addition, IDMs continu... » read more

2017: Manufacturing And Markets


While the industry is busy chatting about the end of Moore's Law and a maturing of the semiconductor industry, the top minds of many companies are having none of it. A slowdown in one area is just an opportunity, in another and that is reflected in the predictions for this year. As in previous years, Semiconductor Engineering will look back on these predictions at the end of the year to see ... » read more

← Older posts