tag: 10nm

One-On-One: Aaron Thean
By Mark LaPedus - 22 Jan, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss process technology, transistor trends and other topics with Aaron Thean, vice president of process technologies and director of the logic devices R&D program at Imec. SE: Chipmakers are ramping up the 16nm/14nm logic node, with 10nm and 7nm in R&D. What’s the current timeline for 10nm and 7nm? Thean: 10nm is on its way. We will see r... » read more

Signal Integrity Issues
By Ed Sperling - 21 Jan, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss signal integrity with Rob Aitken, research fellow at [getentity id="22186" comment="ARM"]; PV Srinivas, senior director of engineering for the Place & Route Division of [getentity id="22017" e_name="Mentor Graphics"]; and Bernard Murphy, chief technology officer at [getentity id="22026" e_name="Atrenta"]. What follows are excerpts of that conver... » read more

Unraveling The Mysteries At IEDM
By Mark LaPedus - 19 Dec, 2014 - Comments: 0

In some respects, the 2014 IEEE International Electron Devices Meeting (IEDM) was no different than past events. The event, held this week in San Francisco, included the usual and dizzying array of tutorials, sessions, papers and panels. On the leading-edge CMOS front, for example, the topics included [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D IC"] chips, III-V materials, [getkc ... » read more

What’s The Other Guy Doing?
By Ed Sperling - 11 Dec, 2014 - Comments: 0

Competition is generally a good thing. It improves service, promotes innovation, forces efficiencies and price cuts where necessary, and it ratchets up the pressure to bring products and services to market faster. Those who can't keep up usually lose market share, and eventually the business sector consolidates until something comes along to disrupt it. That cycle has been repeated in every ... » read more

Design Rules Explode At New Nodes
By Ed Sperling - 17 Nov, 2014 - Comments: 0

Semiconductor Engineering sat down changing design rules with Sergey Shumarayev, senior director of custom IP design at Altera; Luigi Capodieci, R&D fellow at [getentity id="22819" comment="GlobalFoundries"]; Michael White, director of product marketing for Calibre Physical Verification at [getentity id="22017" e_name="Mentor Graphics"], and Coby Zelnik, CEO of [getentity id="22478" e_name=... » read more

Photoresist Problems Ahead
By Ann Mutschler - 14 Nov, 2014 - Comments: 2

As the semiconductor industry begins its ramp to manufacturing at 10nm and below, activity is heating up involving lithography modeling. The goal is to be ready when all the pieces of the puzzle are in place. That includes [gettech id="31045" comment="EUV"], when it finally becomes commercially viable, as well as extending ArF [getkc id="80" comment="lithography"]. When it comes to lithogra... » read more

Future Directions Unknown
By Ed Sperling - 13 Nov, 2014 - Comments: 0

The semiconductor industry has been on cruise control when it comes to shrinking features, but as process technology progresses to 10nm and 7nm there will be some significant changes. For one thing, the cost per new design will continue to rise, which means only the largest companies with the biggest market opportunity will be able to invest at the leading-edge nodes. Chips for mobile phones... » read more

Re-Engineering The FinFET
By Mark LaPedus - 13 Nov, 2014 - Comments: 0

The semiconductor industry is still in the early stages of the [getkc id="185" kc_name="finFET"] era, but the [getkc id="26" kc_name="transistor"] technology already is undergoing a dramatic change. The fins themselves are getting a makeover. In the first-generation finFETs, the fins were relatively short and tapered. In the next wave, the fins are expected to get taller, thinner and more re... » read more

Executive Insight: Elmar Platzgummer
By Mark LaPedus - 13 Nov, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss photomask and lithography trends with Elmar Platzgummer, chief executive of IMS Nanofabrication, an Austrian-based supplier of multi-beam e-beam tools for mask writing applications. SE: IMS has shipped the world’s first multi-beam e-beam system. Initially targeted for photomask writing, the tools are currently being tested in the field. How lon... » read more

Design Rules Explode At New Nodes
By Ed Sperling - 03 Nov, 2014 - Comments: 0

Semiconductor Engineering sat down changing design rules with Sergey Shumarayev, senior director of custom IP design at Altera; Luigi Capodieci, R&D fellow at [getentity id="22819" comment="GlobalFoundries"]; Michael White, director of product marketing for Calibre Physical Verification at [getentity id="22017" e_name="Mentor Graphics"], and Coby Zelnik, CEO of [getentity id="22478" e_name=... » read more

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