While true 3D ICs are a few years off, 2.5D is here. There are some key differences, namely that with 2.5D the interposer is a passive die, but there also are some fundamental shared requirements.
Samta Bansal, senior product marketing for Silicon Realization at Cadence asserted that first, the digital, custom and package environments must be seamless. “There has to be a co-design between ...
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