tag: 2.5D

BEOL Issues At 10nm And 7nm (Part 1)
By Ed Sperling - 15 Dec, 2016 - Comments: 5

Semiconductor Engineering sat down to discuss problems with the back end of line at leading-edge nodes with Craig Child, senior manager and deputy director for [getentity id="22819" e_name="GlobalFoundries'"] advanced technology development integration unit; Paul Besser, senior technology director at [getentity id="22820" comment="Lam Research"]; David Fried, CTO at [getentity id="22210" e_name... » read more

Optimizing Multiple IoT Layers
By Ann Mutschler - 01 Dec, 2016 - Comments: 0

As the number of connected devices rises, so do questions about how to optimize them for target markets, how to ensure they play nicely together, and how to bring them to market quickly and inexpensively. [getkc id="76" kc_name="IoT"] is broad term that encompasses a lot of disparate pieces for devices, systems, and connected systems. At the highest levels are hardware and software, but with... » read more

7nm Design Success Starts With Multi-Domain Multi-Physics Analysis
By Arvind Vel - 28 Nov, 2016 - Comments: 1

Companies can benefit from advancements in the latest semiconductor process technology by delivering smaller, faster and lower power products, especially for those servicing mobile, high performance computing and automotive ADAS applications. By using 7nm processes, design teams are able to add a lot more functionality onto a single chip and lower the power consumption by scaling operating volt... » read more

Advanced Packaging Requires Better Yield
By Ed Sperling - 17 Nov, 2016 - Comments: 1

Whether Moore's Laws truly ends, or whether the semiconductor industry reaches into the Angstrom world after 3nm—the semiconductor industry dislikes fractions—advanced packaging increasingly will dominate semiconductor designs. Apple already is on board with its iPhone 7, using TSMC's fan-out approach. And all of the major foundries and OSATs are lining up with a long list of capabilitie... » read more

Making 2.5D, Fan-Outs Cheaper
By Ed Sperling - 17 Nov, 2016 - Comments: 2

Now that it has been shown to work, the race is on to make advanced [getkc id="27" kc_name="packaging"] more affordable. While device scaling could continue for another decade or more, the number of companies that can afford to develop SoCs at the leading edge will continue to decline. The question now being addressed is what can supplant it, supplement it, or redefine it. At the center o... » read more

Partitioning For Power
By Ed Sperling - 14 Nov, 2016 - Comments: 0

Examine any smartphone design today and most of the electronic circuitry is "off" most of the time. And regardless of how many processor cores are available, it's rare to use more than a couple of those cores at any point in time. The emphasis is shifting, though, as the mobility market flattens and other markets such as driver-assisted vehicles and IoT begin gaining traction. In a car, turn... » read more

Moore’s Law Debate Continues
By Ann Mutschler - 02 Nov, 2016 - Comments: 0

Does shrinking devices still make sense from a cost and performance perspective? The answer isn’t so simple anymore. Still, the discussion as to whether semiconductors are still on track with [getkc id="74" comment="Moore's Law"] occurs on a frequent enough basis to continue analyzing at least some of the dynamics at play. There is much speculation about what happens after 7nm, as well as ... » read more

Silicon Photonics Comes Into Focus
By Ed Sperling - 31 Oct, 2016 - Comments: 5

Silicon photonics is attracting growing attention and investment as a companion technology to copper wiring inside of data centers, raising new questions about what comes next and when. Light has always been the ultimate standard for speed. It requires less energy to move large quantities of data, generates less heat than electricity, and it can work equally well over long or short distances... » read more

The Battle To Embed The FPGA
By Brian Bailey - 31 Oct, 2016 - Comments: 1

There have been many attempts to embed an [gettech id="31071" comment="FPGA"] into chips in the past, but the market has failed to materialize—or the solutions have failed to inspire. An early example was [getentity id="22924" comment="Triscend"], founded in 1997 and acquired by [getentity id="22839" e_name="Xilinx"] in 2004. It integrated a CPU—which varied from an [getentity id="22186" co... » read more

Tech Talk: Embedded Memories
By Ed Sperling - 25 Oct, 2016 - Comments: 0

Dave Eggleston, vice president of embedded memory at GlobalFoundries, talks about the pros and cons of new types of embedded memory, including which work best for certain applications and with various advanced packaging options. [youtube vid=7D9zoA9FFIw] » read more

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