tag: 2.5D

Advanced Packaging For Automotive Chips
By Ann Mutschler - 02 Dec, 2021 - Comments: 0

Multiple types of chips may be better than one for dealing with large amounts and different types of data, but in automotive applications it's not entirely clear how or even whether they should be packaged together. The biggest problem with electronics in vehicles is the extreme range of temperatures, both within and outside of vehicles. Without adequate cooling, chips can age prematurely, s... » read more

Advanced Packaging Shifts Design Focus To System Level
By Ann Mutschler - 23 Nov, 2021 - Comments: 0

Growing momentum for advanced packaging is shifting design from a die-centric focus toward integrated systems with multiple die, but it's also straining some EDA tools and methodologies and creating gaps in areas where none existed. These changes are causing churn in unexpected areas. For some chip companies, this has resulted in a slowdown in hiring of ASIC designers and an uptick in new jo... » read more

HBM2E Raises The Bar For Memory Bandwidth
By Rambus - 10 Nov, 2021 - Comments: 0

AI/ML training capabilities are growing at a rate of 10X per year driving rapid improvements in every aspect of computing hardware and software. HBM2E memory is the ideal solution for the high bandwidth requirements of AI/ML training, but entails additional design considerations given its 2.5D architecture. Designers can realize the full benefits of HBM2E memory with the silicon-proven memory s... » read more

What’s Missing For Designing Chips At The System Level
By Ed Sperling - 01 Nov, 2021 - Comments: 0

Semiconductor Engineering sat down to talk about design challenges in advanced packages and nodes with John Lee, vice president and general manager for semiconductors at Ansys; Shankar Krishnamoorthy, general manager of Synopsys' Design Group; Simon Burke, distinguished engineer at Xilinx; and Andrew Kahng, professor of CSE and ECE at UC San Diego. This discussion was held at the Ansys IDEAS co... » read more

Partitioning For Better Performance And Power
By Ann Mutschler - 28 Oct, 2021 - Comments: 0

Partitioning is becoming more critical and much more complex as design teams balance different ways to optimize performance and power, shifting their focus from a single chip to a package or system involving multiple chips with very specific tasks. Approaches to design partitioning have changed over the years, most recently because processor clock speeds have hit a wall while the amount of d... » read more

3D Printing For More Circuits
By Ann R. Thryft - 27 Oct, 2021 - Comments: 0

After several years of experimentation, and growing success in volume manufacturing for some use cases, technologies for 3D printing of electronic circuits are becoming more common. Some innovations in processes and materials are moving these technologies closer to mainstream electronics manufacturing. Christopher Tuck, professor of material science at the University of Nottingham, observed ... » read more

Scaling Bump Pitches In Advanced Packaging
By Mark LaPedus - 25 Oct, 2021 - Comments: 0

Interconnects for advanced packaging are at a crossroads as an assortment of new package types are pushing further into the mainstream, with some vendors opting to extend the traditional bump approaches while others roll out new ones to replace them. The goal in all cases is to ensure signal integrity between components in IC packages as the volume of data being processed increases. But as d... » read more

HBM3: Big Impact On Chip Design
By Ann Mutschler - 14 Oct, 2021 - Comments: 0

An insatiable demand for bandwidth in everything from high-performance computing to AI training, gaming, and automotive applications is fueling the development of the next generation of high-bandwidth memory. HBM3 will bring a 2X bump in bandwidth and capacity per stack, as well as some other benefits. What was once considered a "slow and wide" memory technology to reduce signal traffic dela... » read more

Architecting Interposers
By Brian Bailey - 14 Oct, 2021 - Comments: 0

An interposer performs a similar function as a printed circuit board (PCB), but when the interposer is moved inside a package the impact is significant. Neither legacy PCB nor IC design tools can fully perform the necessary design and analysis tasks. But perhaps even more important, adding an interposer to a design may require organizational changes. Today, leading-edge companies have shown ... » read more

HBM3 Memory: Break Through To Greater Bandwidth
By Rambus - 06 Oct, 2021 - Comments: 0

AI/ML’s demands for greater bandwidth are insatiable driving rapid improvements in every aspect of computing hardware and software. HBM memory is the ideal solution for the high bandwidth requirements of AI/ML training, but it entails additional design considerations given its 2.5D architecture. Now we’re on the verge of a new generation of HBM that will raise memory and capacity to new hei... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy