Week In Review: Manufacturing, Test

By Mark LaPedus - 25 Sep, 2020 - Comments: 0

Top stories Here's the latest from Reuters: ''The United States has imposed restrictions on exports to China’s biggest chip maker SMIC after concluding there is an 'unacceptable risk' equipment supplied to it could be used for military purposes." What does this all mean? “The press has reported that on Friday, the U.S. Department of Commerce placed restrictions on China's largest semicondu... » read more

Embedded Phase-Change Memory Emerges

By Mark LaPedus - 24 Jan, 2019 - Comments: 3

The next-generation memory market for embedded applications is becoming more crowded as another technology emerges in the arena—embedded phase-change memory. Phase-change memory is not new and has been in the works for decades. But the technology has taken longer to commercialize amid a number of technical and cost challenges. Phase-change memory, a nonvolatile memory type that stores data... » read more

New Applications, Multiple Approaches

By Gary Patton - 15 Mar, 2018 - Comments: 0

It may be tempting to view the strong demand for semiconductors as just one more up-cycle in our traditionally cyclical industry, but what’s really driving things right now is the opening of entirely new horizons, made possible by the increased capabilities of today’s chips. Chip demand is no longer only being driven by the needs of computer and smartphone manufacturers. Now, a mushroomi... » read more

One-On-One: Thomas Caulfield

By Mark LaPedus - 21 May, 2015 - Comments: 0

Semiconductor Engineering sat down to talk about fabs, process technology and the equipment industry with Thomas Caulfield, senior vice president and general manager of Fab 8 at [getentity id="22819" comment="GlobalFoundries"]. Located in Saratoga County, N.Y., Fab 8 is GlobalFoundries’ most advanced 300mm wafer fab. What follows are excerpts of that discussion. SE: Last year, GlobalFoundr... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: 22nm FD-SOI

Week In Review: Manufacturing, Test

Embedded Phase-Change Memory Emerges

New Applications, Multiple Approaches

One-On-One: Thomas Caulfield

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Knowledge Centers
Entities, people and technologies explored